Price Trend
Company News
Samsung Electronics to Produce 2nm AI Chips for Japan's Preferred Networks
Samsung Electronics Develops Custom HBM for AI Market, Anticipates Commercialization with HBM4 Mass Production
Samsung to Introduce FOWLP-HPB-CFM Technology for Improved Thermal Management in Mobile APs
Kioxia Introduces 2Tb QLC Flash Memory with the Latest BiCS FLASH Technology
SK Hynix to Invest Nearly $60 Billion in HBM and AI-Related Semiconductor Fields by 2028
Samsung Ramps Up Memory Production to Meet Rising Demand
Kioxia Aims for IPO by End of October - CFM Flash Memory Market
Samsung Seeks $3.6 Billion Loan from Korea Development Bank for Chip Investment
Samsung Electronics to Resume Construction of Pyeongtaek P5 Factory in Q3 Amidst AI-driven Demand Surge
Micron's Taiwan Plant Fire Extinguished Without Injuries or Operational Impact
Kioxia Aims for 1,000-Layer 3D NAND Technology by 2027, Western Digital May Not Follow
Samsung Electronics Announces Organizational Restructuring for H2, Emphasizes "Synergy and Streamlining"
Micron Ramps Up Global HBM Memory Production to Boost Market Share
Samsung to Launch 3D HBM Chip Packaging Service by Year-End
SK Hynix Gears Up for Next-Gen High Bandwidth Memory (HBM) Demand with 5th Generation (1b) 10nm DRAM Expansion
Financial Reporting
Micron Fiscal Q3 2024 Earnings
Longsys Fiscal Q1 2024 Earnings
Longsys Fiscal Q4 2023 Earnings
Netac Fiscal Q1 2024 Earnings
Netac Fiscal Q4 2023 Earnings
Tongfu Microelectronics 2024Q1 Earning release
Tongfu Microelectronics 2023 Earning release
Tongfu Microelectronics 2023Q3 Earning release
Tongfu Microelectronics 2023H1 Earning release
Tongfu Microelectronics 2023Q1 Earning release
HT-tech 2024Q1 Earning release
Stock Information
Update: 07-16 04:28,Data has delay
Samsung KRW 86700 +2.73%
SK Hynix KRW 230000 -1.29%
Micron USD 130.870 -2.01%
Intel USD 34.460 -0.09%
WDC USD 78.820 +0.06%
Nanya TWD 67.7 -1.17%
Winbond TWD 25.35 -1.74%
Phison TWD 599 +0.67%
SMI USD 79.820 -1.08%
Marvell USD 73.600 +0.01%
ASolid TWD 77.8 -0.77%
Goke CNY 53.60 -1.13%
Longsys CNY 95.88 -3.39%
Seagate USD 108.940 +1.72%
Innodisk TWD 310 -0.16%
Transcend TWD 101 -0.98%
A-DATA TWD 99.3 -2.65%
SMART Global USD 29.350 +1.56%
Netac CNY 17.94 -0.55%
BWCC CNY 63.86 -2.71%
Techwinsemi CNY 93.10 -4.34%
DAWEI CNY 9.53 -3.44%
OSE TWD 55.4 -1.6%
PTI TWD 201 +3.61%
JCET CNY 34.75 +3.52%
ASE TWD 179.5 +1.13%
TFME CNY 23.50 +0.43%
HT-tech CNY 8.72 +0.58%
Hot news
Samsung launches dedicated HBM, advanced chip packaging teams   24/07/05
Samsung Electronics Co., has officially launched a team dedicated to developing advanced high-bandwidth (HBM) memory, a core chip to power artificial intelligence (AI) devices.
Flash Wafer Last update:24/07/15 18:00 GMT+8
Item Price Daily High Daily Low Change
1Tb QLC 7.00 7.00 7.00 0.00 View
1Tb TLC 7.50 7.50 7.50 0.00 View
512Gb TLC 4.00 4.00 4.00 0.00 View
256Gb TLC 1.90 1.90 1.90 0.00 View
DDR Last update:24/07/09 11:00 GMT+8
Item This Week Last Week Change
DDR4 16Gb 3200 3.00 2.97 0.03 View
DDR4 8Gb 3200 1.35 1.35 0.00 View
DDR Module (Channel) Last update:24/07/09 11:00 GMT+8
Item This Week Last Week Change
DDR4 UDIMM 8GB 3200 10.80 10.80 0.00 View
DDR4 UDIMM 16GB 3200 20.60 20.60 0.00 View
DDR4 UDIMM 32GB 3200 41.00 41.00 0.00 View
DDR Module (OEM) Last update:24/07/09 11:00 GMT+8
Item This Week Last Week Change
DDR4 SODIMM 4GB 3200 9.60 9.60 0.00 View
DDR4 SODIMM 8GB 3200 15.50 15.50 0.00 View
DDR4 SODIMM 16GB 3200 26.00 26.50 0.50 View
DDR Module (Server) Last update:24/07/09 11:00 GMT+8
Item This Month Last Month Change
DDR4 RDIMM 16GB 3200 54.00 54.00 0.00 View
DDR4 RDIMM 32GB 3200 88.00 88.00 0.00 View
SSD(Channel) Last update:24/07/09 11:00 GMT+8
Item Interface This Week Last Week Change
SSD 120GB SATA 3 6.20 6.20 0.00 View
SSD 240GB SATA 3 12.00 12.00 0.00 View
SSD(OEM) Last update:24/07/09 11:00 GMT+8
Item Interface This Week Last Week Change
SSD 256GB SATA 3 17.50 17.80 0.30 View
SSD 256GB PCIe 3.0 20.00 20.00 0.00 View
LPDDR Last update:24/07/09 11:00 GMT+8
Item This Week Last Week Change
LPDDR4X 48Gb 14.00 14.00 0.00 View
LPDDR4X 32Gb 8.00 8.00 0.00 View
LPDDR4X 16Gb 3.70 3.70 0.00 View
eMMC Last update:24/07/09 11:00 GMT+8
Item This Week Last Week Change
eMMC 8GB 5.1 1.70 1.70 0.00 View
eMMC 16GB 5.1 2.30 2.30 0.00 View
eMMC 32GB 5.1 2.45 2.45 0.00 View
eMCP Last update:24/07/09 11:00 GMT+8
Item This Week Last Week Change
eMCP(eMMC + LPDDR4X)64GB+32Gb 14.50 14.50 0.00 View
eMCP(eMMC + LPDDR4X)128GB+32Gb 18.20 18.20 0.00 View
UFS Last update:24/07/09 11:00 GMT+8
Item This Week Last Week Change
UFS 2.2 64GB 5.30 5.30 0.00 View
UFS 2.2 128GB 10.00 10.00 0.00 View
UFS 2.2 256GB 19.00 19.00 0.00 View
uMCP Last update:24/07/09 11:00 GMT+8
Item This Week Last Week Change
uMCP(LPDDR4X + UFS2.2)4GB+128GB 18.50 18.50 0.00 View
uMCP(LPDDR4X + UFS2.2)6GB+128GB 23.50 23.50 0.00 View
Flash Card Last update:24/07/15 18:00 GMT+8
Item Price Daily High Daily Low Change
OEM MicroSD 16GB C10 1.10 1.10 1.10 0.00 View
OEM MicroSD 32GB C10 1.45 1.45 1.45 0.00 View
OEM MicroSD 64GB C10 1.90 1.90 1.90 0.00 View
USB 2.0 Last update:24/07/15 18:00 GMT+8
Item Price Daily High Daily Low Change
USB2.0(PCBA) 16GB 1.10 1.10 1.10 0.00 View
USB2.0(Micro COB) 16GB 1.12 1.12 1.12 0.00 View
USB 3.0 Last update:24/07/15 13:00 GMT+8
Item Price Week High Week Low Change
USB3.0(PCBA) 16GB 1.41 1.41 1.41 0.00 View
USB3.0(PCBA) 32GB 1.70 1.70 1.70 0.00 View
USB3.0(Micro COB) 16GB 1.60 1.60 1.60 0.00 View
USB3.0(Micro COB) 32GB 1.80 1.80 1.80 0.00 View
Recommended News
2024/07/15
South Korea's Storage Chip Exports Surge 85.2% YoY in June, Reaching $8.83 Billion
2024/07/15
Global Smartphone Sales Surge for the Third Consecutive Quarter
2024/07/12
Semiconductor Equipment Sales to Reach Record Highs in 2024 and 2025
2024/07/12
AI-Driven Demand Sparks HBM Production Capacity Race Among Leading Chipmakers
2024/07/10
KCTech’s supercritical cleaner being evaluated for SK Hynix’s DRAM line
2024/07/09
Samsung and SK Hynix Explore Laser Technology to Improve HBM Wafer Processing
2024/07/08
Global Semiconductor Sales Surge by Nearly 20% in May, Reaching $49.1 Billion
2024/07/05
Samsung launches dedicated HBM, advanced chip packaging teams
2024/07/03
Samsung applies molybdenum in Gen 9 V-NAND
2024/07/02
Micron Aims for 25% HBM Market Share by 2025 Amid Intense Competition
2024/07/01
Japanese Electronics Component Shipments Soar to 2.5-Year High
2024/07/01
Micron Technology Enters High-End Memory Market, Introducing New Competition for Samsung and SK Hynix
2024/06/28
Tokyo Electron's Ambitious $10 Billion Investment Plan
2024/06/28
Apple Develops New Technology to Simplify iPhone 16 Battery Replacement
2024/06/27
South Korea Invests $200 Million in Semiconductor Packaging R&D

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