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Samsung launches dedicated HBM, advanced chip packaging teams 24/07/05
Samsung Electronics Co., has officially launched a team dedicated to developing advanced high-bandwidth (HBM) memory, a core chip to power artificial intelligence (AI) devices.
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2024-07-09 7.1 13.1 9.6
2024-07-02 7.1 13.1 9.6
2024-06-25 7.1 13.1 9.6
2024-06-18 7.1 13.1 9.6
2024-06-11 7.1 13.1 9.6
2024-06-04 7.1 13.1 9.6
2024-05-28 7.5 13.5 10
2024-05-21 7.5 13.5 10
2024-05-14 8 14 10.5
2024-05-07 8.5 14.5 11
2024-04-30 8.5 14.5 11
2024-04-23 8.5 14.5 11
2024-04-16 8.5 14.5 11