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SK hynix Prepares for ‘Fan-out Packaging’ with Next-generation HBM 23/11/27
According to industry sources on Nov. 26, SK hynix is preparing to integrate 2.5D Fan-out packaging technology into its next generation of DRAM after HBM.
Historical Price Information:
Date
Low
High
Avg
2023-11-28 6.5 12.5 9
2023-11-21 6.5 12.5 9
2023-11-14 6.3 12.3 8.8
2023-11-07 6.3 12.3 8.8
2023-10-31 6.3 12.3 8.8
2023-10-24 6.3 12.3 8.8
2023-10-17 6.3 12.3 8.8
2023-10-10 6.3 12.3 8.8
2023-09-26 6.3 12.3 8.8
2023-09-19 6.3 12.3 8.8
2023-09-12 6.3 12.3 8.8
2023-09-05 6.3 12.3 8.8