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South Korea's NAND Flash Exports See 13.1% Drop in Q4 Amid Market Challenges　 25/01/16
In the fourth quarter of last year, South Korea's NAND flash exports experienced a significant decline, falling by 13.1%.
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In addition to advancements in custom chip design, significant changes are also occurring in the memory market.
Notice of New Year's Day Holiday　 24/12/31
Due to the New Year's holiday, all product quotations will be discontinued on January 1st, 2025 and resumed on January 2nd, 2025.
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2024-12-24
SK Hynix wins large order for HBM from Broadcom
2024-12-19
Samsung Electronics to Establish Test Line for 7th Generation DRAM at 10nm Level
2024-12-09
Samsung Completes Development of Groundbreaking 400-layer NAND Technology
2024-12-09
CXL Consortium Announces Compute Express Link 3.2 Specification Release
2024-12-06
SK Hynix beefs up executive team amid high number of promotions
2024-12-03
Korea’s Nov. exports up 1.4% on solid chip demand
2024-11-26
Samsung succeeds in reducing use of PR during 3D NAND lithography
2024-11-25
Nvidia CEO signals Samsung’s imminent shipment of HBM3E
2024-11-20
Tesla asks Samsung, SK Hynix to supply HBM4 chip samples
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Samsung Electronics Expands Packaging Facilities in Suzhou
2024-11-12
Samsung Electronics to expand chip packaging facilities for HBM
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KIOXIA invests $230 million to develop CXL power-saving memory for AI
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Samsung Electronics' Pingze P4 plans to simultaneously mass produce NAND and DRAM
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KIOXIA is seeking an IPO before June next year and is still exploring the possibility of going public within this year
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SK Hynix to provide HBM3E 16H samples in early 2025

 
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