The HBM4 chip could also be used in Tesla’s AI data centers under development and its self-driving cars, which are currently fitted with HBM2E chips for pilot programs.
The new facilities, expected to be completed by December 2027, will feature advanced packaging lines for HBM chips, which are in high demand due to their essential role in AI computing.
According to industry sources cited by South Korean media, Samsung Electronics has determined the investment direction for the first production line in the Pingze Fourth Park (P4), recently changed the name of the production line, and started preparing for simultaneous mass production of NAND and DRAM.
