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SK hynix Prepares for ‘Fan-out Packaging’ with Next-generation HBM 23/11/27
According to industry sources on Nov. 26, SK hynix is preparing to integrate 2.5D Fan-out packaging technology into its next generation of DRAM after HBM.
Historical Price Information:
Date
Low
High
Avg
2023-11-28 20 24 23
2023-11-21 20 24 23
2023-11-14 20 24 23
2023-11-07 20 24 23
2023-10-31 18.2 21.5 21
2023-10-24 17.2 18 17.8
2023-10-17 17.2 18 17.8
2023-10-10 17.2 18 17.6
2023-09-26 17.2 18 17.6
2023-09-19 17.2 18 17.6
2023-09-12 17.2 17.8 17.6
2023-09-05 17.2 17.4 17.3