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SK hynix Prepares for ‘Fan-out Packaging’ with Next-generation HBM
23/11/27
According to industry sources on Nov. 26, SK hynix is preparing to integrate 2.5D Fan-out packaging technology into its next generation of DRAM after HBM.
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Date
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2023-11-28
20
24
23
2023-11-21
20
24
23
2023-11-14
20
24
23
2023-11-07
20
24
23
2023-10-31
18.2
21.5
21
2023-10-24
17.2
18
17.8
2023-10-17
17.2
18
17.8
2023-10-10
17.2
18
17.6
2023-09-26
17.2
18
17.6
2023-09-19
17.2
18
17.6
2023-09-12
17.2
17.8
17.6
2023-09-05
17.2
17.4
17.3