Sandisk Corporation announced it has signed a landmark Memorandum of Understanding (MOU) with SK hynix to work together to establish the specification for High Bandwidth Flash – a new technology designed to deliver breakthrough memory capacity and performance for the next generation of AI inferences. Through this collaboration, the companies expect to standardize the specification, define technology requirements and explore the creation of a technology ecosystem for High Bandwidth Flash.

As AI models grow larger and more complex, inference workloads demand both massive bandwidth and significantly greater memory capacity. Designed for AI inference workloads in large data centers, small enterprises and edge applications, HBF is targeted to offer comparable bandwidth to High Bandwidth Memory (HBM) while delivering up to 8-16x the capacity of HBM at a similar cost.

Enabled by Sandisk’s advanced BiCS technology and proprietary CBA wafer bonding and developed over the past year with input from leading AI industry players, Sandisk’s HBF technology was awarded “Best of Show, Most Innovative Technology” at FMS: the Future of Memory and Storage 2025. Sandisk targets to deliver first samples of its HBF memory in the second half of calendar 2026 and expects samples of the first AI-inference devices with HBF to be available in early 2027.