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Samsung launches dedicated HBM, advanced chip packaging teams
24/07/05
Samsung Electronics Co., has officially launched a team dedicated to developing advanced high-bandwidth (HBM) memory, a core chip to power artificial intelligence (AI) devices.
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Date
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2024-07-09
4.6
5.6
5.3
2024-07-02
4.6
5.6
5.3
2024-06-25
4.6
5.6
5.3
2024-06-18
4.6
5.6
5.3
2024-06-11
4.6
5.6
5.3
2024-06-04
4.6
5.6
5.3
2024-05-28
4.6
5.6
5.3
2024-05-21
4.6
5.6
5.3
2024-05-14
4.6
5.6
5.3
2024-05-07
4.8
5.8
5.5
2024-04-30
4.8
5.8
5.5
2024-04-23
4.8
5.8
5.5
2024-04-16
4.8
5.8
5.5