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SK hynix Prepares for ‘Fan-out Packaging’ with Next-generation HBM 23/11/27
According to industry sources on Nov. 26, SK hynix is preparing to integrate 2.5D Fan-out packaging technology into its next generation of DRAM after HBM.
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2023-11-29 5.1 5.1 5.1
2023-11-28 5.1 5.1 5.1
2023-11-27 4.95 4.95 4.95
2023-11-24 4.95 4.95 4.95
2023-11-23 4.9 4.9 4.9
2023-11-22 4.9 4.9 4.9
2023-11-21 4.9 4.9 4.9
2023-11-20 4.85 4.85 4.85
2023-11-17 4.85 4.85 4.85
2023-11-16 4.85 4.85 4.85
2023-11-15 4.8 4.8 4.8
2023-11-14 4.8 4.8 4.8
2023-11-13 4.5 4.5 4.8
2023-11-10 4.5 4.5 4.5
2023-11-09 4.5 4.5 4.5
2023-11-08 4.5 4.5 4.5
2023-11-07 4.4 4.4 4.4
2023-11-06 4.4 4.4 4.4
2023-11-03 4.4 4.4 4.4
2023-11-02 4.3 4.3 4.3
2023-11-01 4.3 4.3 4.3
2023-10-31 4.3 4.3 4.3
2023-10-30 4.2 4.2 4.2