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Samsung launches dedicated HBM, advanced chip packaging teams
24/07/05
Samsung Electronics Co., has officially launched a team dedicated to developing advanced high-bandwidth (HBM) memory, a core chip to power artificial intelligence (AI) devices.
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Date
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2024-07-09
3.5
4
3.7
2024-07-02
3.5
4
3.7
2024-06-25
3.5
4
3.7
2024-06-18
3.5
4
3.7
2024-06-11
3.5
4.1
3.7
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3.5
4.1
3.7
2024-05-28
3.5
4.1
3.7
2024-05-21
3.5
4.1
3.7
2024-05-14
3.5
4.1
3.7
2024-05-07
3.5
4.1
3.7
2024-04-30
3.5
4.1
3.7
2024-04-23
3.5
4.1
3.7
2024-04-16
3.5
4.1
3.7