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SK hynix Prepares for ‘Fan-out Packaging’ with Next-generation HBM 23/11/27
According to industry sources on Nov. 26, SK hynix is preparing to integrate 2.5D Fan-out packaging technology into its next generation of DRAM after HBM.
Historical Price Information:
Date
Low
High
Avg
2023-11-28 2.3 3.05 2.8
2023-11-21 2.3 3.05 2.8
2023-11-14 2.3 3.05 2.8
2023-11-07 2.3 3.05 2.8
2023-10-31 2.28 3.03 2.78
2023-10-24 2.2 2.95 2.7
2023-10-17 2.15 2.9 2.65
2023-10-10 2.05 2.8 2.55
2023-09-26 1.95 2.7 2.45
2023-09-19 1.93 2.68 2.43
2023-09-12 1.9 2.65 2.4
2023-09-05 1.9 2.65 2.4