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SK hynix Prepares for ‘Fan-out Packaging’ with Next-generation HBM
23/11/27
According to industry sources on Nov. 26, SK hynix is preparing to integrate 2.5D Fan-out packaging technology into its next generation of DRAM after HBM.
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Date
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Avg
2023-11-28
16
20
19
2023-11-21
16
20
19
2023-11-14
16
20
19
2023-11-07
16
20
19
2023-10-31
15.3
18.5
17.5
2023-10-24
14.3
16
14.7
2023-10-17
14.3
16
14.7
2023-10-10
14.3
16
14.7
2023-09-26
14.3
16
14.7
2023-09-19
14.3
16
14.7
2023-09-12
14.3
14.8
14.7
2023-09-05
14.3
14.5
14.4