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SK hynix Prepares for ‘Fan-out Packaging’ with Next-generation HBM 23/11/27
According to industry sources on Nov. 26, SK hynix is preparing to integrate 2.5D Fan-out packaging technology into its next generation of DRAM after HBM.
Historical Price Information:
Date
Low
High
Avg
2023-11-28 16 20 19
2023-11-21 16 20 19
2023-11-14 16 20 19
2023-11-07 16 20 19
2023-10-31 15.3 18.5 17.5
2023-10-24 14.3 16 14.7
2023-10-17 14.3 16 14.7
2023-10-10 14.3 16 14.7
2023-09-26 14.3 16 14.7
2023-09-19 14.3 16 14.7
2023-09-12 14.3 14.8 14.7
2023-09-05 14.3 14.5 14.4