Hot news
SK hynix Prepares for ‘Fan-out Packaging’ with Next-generation HBM 23/11/27
According to industry sources on Nov. 26, SK hynix is preparing to integrate 2.5D Fan-out packaging technology into its next generation of DRAM after HBM.
Historical Price Information:
Date
Low
Open
Close
2023-11-29 2.7 2.7 2.7
2023-11-28 2.7 2.7 2.7
2023-11-27 2.6 2.6 2.6
2023-11-24 2.6 2.6 2.6
2023-11-23 2.55 2.55 2.55
2023-11-22 2.55 2.55 2.55
2023-11-21 2.55 2.55 2.55
2023-11-20 2.5 2.5 2.5
2023-11-17 2.5 2.5 2.5
2023-11-16 2.5 2.5 2.5
2023-11-15 2.45 2.45 2.45
2023-11-14 2.45 2.45 2.45
2023-11-13 2.35 2.35 2.45
2023-11-10 2.35 2.35 2.35
2023-11-09 2.35 2.35 2.35
2023-11-08 2.35 2.35 2.35
2023-11-07 2.3 2.3 2.3
2023-11-06 2.3 2.3 2.3
2023-11-03 2.25 2.25 2.25
2023-11-02 2.25 2.25 2.25
2023-11-01 2.25 2.25 2.25
2023-10-31 2.25 2.25 2.25
2023-10-30 2.15 2.15 2.15