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Micron's 12-Layer HBM3E Chips in Volume Production 24/09/10
Micron Technology has announced the volume production of its 12-layer High Bandwidth Memory 3 Extended (HBM3E) chips, featuring a capacity of 36GB and speeds exceeding 9.2Gb/s. The new memory stacks are designed for next-generation AI GPUs and are currently undergoing customer validation.
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