Price Trend
NAND Index
DRAM Index
Stock Information
Update: 07-07 06:19 ,Data has delay
Samsung
KRW
63300
-0.78%
SK Hynix
KRW
270500
-2.87%
KIOXIA
JPY
2380
-6.59%
Micron
USD
122.290
+0.45%
WDC
USD
66.080
+0.46%
SanDisk
USD
46.410
+0.43%
Nanya
TWD
48.45
-4.25%
Winbond
TWD
19.15
-3.04%
Phison
TWD
478.0
-3.24%
SMI
USD
74.810
+1.11%
Maxio
CNY
41.45
-1.61%
ASolid
TWD
52.3
-3.15%
Longsys
CNY
83.65
-2.51%
Seagate
USD
149.440
-1.65%
Innodisk
TWD
242.5
-1.22%
Transcend
TWD
120.0
+4.80%
A-DATA
TWD
93.6
-2.80%
PENG
USD
20.870
+3.32%
Netac
CNY
23.77
-1.65%
BWCC
CNY
64.97
-2.01%
Techwinsemi
CNY
121.38
+2.60%
DAWEI
CNY
19.15
-4.35%
OSE
TWD
38.20
-2.92%
PTI
TWD
134.5
-1.47%
JCET
CNY
33.23
-0.89%
ASE
TWD
147.0
+2.08%
TFME
CNY
25.09
-1.18%
HT-tech
CNY
9.89
-1.98%
Hot news
Samsung in Talks with Broadcom to Supply 12-layer HBM3E, Estimated Volume Reaches 1 Billion Gb 25/07/04
According to Korean media reports, Samsung Electronics has recently completed quality testing of its 12-layer HBM3E products with Broadcom and is now negotiating mass production supply. The current discussions involve an estimated supply volume of approximately 1 billion gigabits (Gb), with mass production expected to begin as early as the second half of this year and extend into next year.
Flash Wafer
Last update:25/07/04 18:00 GMT+8
DDR
Last update:25/07/01 11:00 GMT+8
DDR Module (Server)
Last update:25/06/03 11:00 GMT+8
DDR Module (Channel)
Last update:25/07/01 11:00 GMT+8
DDR Module (OEM)
Last update:25/07/01 11:00 GMT+8
SSD(Channel)
Last update:25/07/01 11:00 GMT+8
SSD(OEM)
Last update:25/07/01 11:00 GMT+8
LPDDR
Last update:25/07/01 11:00 GMT+8
eMMC
Last update:25/07/01 11:00 GMT+8
eMCP
Last update:25/07/01 11:00 GMT+8
UFS
Last update:25/07/01 11:00 GMT+8
uMCP
Last update:25/07/01 11:00 GMT+8
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