Price Trend
NAND Index
DRAM Index
Stock Information
Update: 09-12 09:47 ,Data has delay
Samsung
KRW
66100
+1.85%
SK Hynix
KRW
166200
+5.73%
Micron
USD
90.650
+4.38%
Intel
USD
19.640
+3.48%
WDC
USD
63.310
+0.83%
Nanya
TWD
45.9
+3.15%
Winbond
TWD
21.05
+2.93%
Phison
TWD
496
+2.37%
SMI
USD
58.330
+1.64%
Marvell
USD
74.890
+4.59%
ASolid
TWD
58.6
+2.81%
Goke
CNY
45.16
+0.94%
Longsys
CNY
67.11
+0.71%
Seagate
USD
102.530
+0.26%
Innodisk
TWD
284
+0.53%
Transcend
TWD
100
+0.81%
A-DATA
TWD
87.4
+1.51%
SMART Global
USD
19.090
+4.26%
Netac
CNY
16.53
+0.98%
BWCC
CNY
43.40
-0.23%
Techwinsemi
CNY
66.11
+0.62%
DAWEI
CNY
10.00
+1.94%
OSE
TWD
37.75
+2.86%
PTI
TWD
138
+3.76%
JCET
CNY
29.45
+0.44%
ASE
TWD
147.5
+2.08%
TFME
CNY
18.71
+1.14%
HT-tech
CNY
7.58
+0.53%
Hot news
Micron's 12-Layer HBM3E Chips in Volume Production 24/09/10
Micron Technology has announced the volume production of its 12-layer High Bandwidth Memory 3 Extended (HBM3E) chips, featuring a capacity of 36GB and speeds exceeding 9.2Gb/s. The new memory stacks are designed for next-generation AI GPUs and are currently undergoing customer validation.
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