Price Trend
Company News
SK hynix Unveils Next-Gen PEB110 SSD for Data Centers
Micron's 12-Layer HBM3E Chips in Volume Production
A-DATA's Steady Revenue and Positive DRAM Market View
KYEC's Steady Revenue and Growing AI Segment
Samsung Electronics Unveils DDR Development Roadmap
Micron's 36GB HBM3E Enters Mass Production
SK Hynix Emphasizes Customization in HBM Memory with Base Die Technology
SK Hynix to Begin Mass Production of 12-layer HBM3E Memory in Late September
Samsung's 1b nm Mobile Memory Yield Issues May Affect Galaxy S25 Series Development
Samsung's Open HBM Memory Strategy
Samsung Delays Foundry Construction to Prioritize Memory Production Lines
SK Hynix Advances HBM4 Development with Advanced Packaging Technologies
Samsung Delays Pyeongtaek P4/P5 Semiconductor Plants to 2026
Samsung Electronics Testing TEL's GCB Equipment for Enhanced EUV Patterning
Micron's Xi'an Factory Kicks Off LPCAMM and MRDIMM Production
Financial Reporting
Micron Fiscal Q3 2024 Earnings
Longsys Fiscal Q1 2024 Earnings
Longsys Fiscal Q4 2023 Earnings
Netac Fiscal Q1 2024 Earnings
Netac Fiscal Q4 2023 Earnings
Tongfu Microelectronics 2024Q1 Earning release
Tongfu Microelectronics 2023 Earning release
Tongfu Microelectronics 2023Q3 Earning release
Tongfu Microelectronics 2023H1 Earning release
Tongfu Microelectronics 2023Q1 Earning release
HT-tech 2024Q1 Earning release
Stock Information
Update: 09-12 09:47,Data has delay
Samsung KRW 66100 +1.85%
SK Hynix KRW 166200 +5.73%
Micron USD 90.650 +4.38%
Intel USD 19.640 +3.48%
WDC USD 63.310 +0.83%
Nanya TWD 45.9 +3.15%
Winbond TWD 21.05 +2.93%
Phison TWD 496 +2.37%
SMI USD 58.330 +1.64%
Marvell USD 74.890 +4.59%
ASolid TWD 58.6 +2.81%
Goke CNY 45.16 +0.94%
Longsys CNY 67.11 +0.71%
Seagate USD 102.530 +0.26%
Innodisk TWD 284 +0.53%
Transcend TWD 100 +0.81%
A-DATA TWD 87.4 +1.51%
SMART Global USD 19.090 +4.26%
Netac CNY 16.53 +0.98%
BWCC CNY 43.40 -0.23%
Techwinsemi CNY 66.11 +0.62%
DAWEI CNY 10.00 +1.94%
OSE TWD 37.75 +2.86%
PTI TWD 138 +3.76%
JCET CNY 29.45 +0.44%
ASE TWD 147.5 +2.08%
TFME CNY 18.71 +1.14%
HT-tech CNY 7.58 +0.53%
Hot news
Micron's 12-Layer HBM3E Chips in Volume Production   24/09/10
Micron Technology has announced the volume production of its 12-layer High Bandwidth Memory 3 Extended (HBM3E) chips, featuring a capacity of 36GB and speeds exceeding 9.2Gb/s. The new memory stacks are designed for next-generation AI GPUs and are currently undergoing customer validation.
Flash Wafer Last update:24/09/11 18:00 GMT+8
Item Price Daily High Daily Low Change
1Tb QLC 6.00 6.00 6.00 0.20 View
1Tb TLC 7.00 7.00 7.00 0.10 View
512Gb TLC 3.70 3.70 3.70 0.10 View
256Gb TLC 1.60 1.60 1.60 0.00 View
DDR Last update:24/09/10 11:00 GMT+8
Item This Week Last Week Change
DDR4 16Gb 3200 2.96 2.97 0.01 View
DDR4 16Gb eTT 2.64 2.65 0.01 View
DDR4 8Gb 3200 1.32 1.32 0.00 View
DDR4 8Gb eTT 1.12 1.12 0.00 View
DDR4 4Gb eTT 0.69 0.69 0.00 View
DDR Module (Server) Last update:24/09/03 11:00 GMT+8
Item This Month Last Month Change
DDR4 RDIMM 16GB 3200 54.00 54.00 0.00 View
DDR4 RDIMM 32GB 3200 88.00 88.00 0.00 View
DDR4 RDIMM 64GB 3200 165.00 165.00 0.00 View
DDR5 RDIMM 32GB 147.00 -- -- View
DDR5 RDIMM 64GB 275.00 -- -- View
DDR5 RDIMM 96GB 460.00 -- -- View
DDR Module (Channel) Last update:24/09/10 11:00 GMT+8
Item This Week Last Week Change
DDR4 UDIMM 8GB 3200 8.90 8.90 0.00 View
DDR4 UDIMM 16GB 3200 17.90 17.90 0.00 View
DDR4 UDIMM 32GB 3200 38.30 38.30 0.00 View
DDR Module (OEM) Last update:24/09/10 11:00 GMT+8
Item This Week Last Week Change
DDR4 SODIMM 4GB 3200 9.50 9.50 0.00 View
DDR4 SODIMM 8GB 3200 15.00 15.00 0.00 View
DDR4 SODIMM 16GB 3200 25.50 25.50 0.00 View
SSD(Channel) Last update:24/09/10 11:00 GMT+8
Item Interface This Week Last Week Change
SSD 256GB PCIe 3.0 12.50 12.50 0.00 View
SSD 512GB PCIe 3.0 22.40 22.40 0.00 View
SSD 1TB PCIe 3.0 43.00 43.00 0.00 View
SSD 512GB PCIe 4.0 29.50 29.50 0.00 View
SSD 1TB PCIe 4.0 46.50 46.50 0.00 View
SSD 2TB PCIe 4.0 88.00 88.00 0.00 View
SSD(OEM) Last update:24/09/10 11:00 GMT+8
Item Interface This Week Last Week Change
SSD 256GB PCIe 3.0 19.50 19.50 0.00 View
SSD 512GB PCIe 3.0 33.00 33.00 0.00 View
SSD 1TB PCIe 3.0 57.00 57.00 0.00 View
SSD 512GB PCIe 4.0 35.00 35.00 0.00 View
SSD 1TB PCIe 4.0 61.00 61.00 0.00 View
SSD 2TB PCIe 4.0 118.00 118.00 0.00 View
LPDDR Last update:24/09/10 11:00 GMT+8
Item This Week Last Week Change
LPDDR4X 48Gb 12.60 12.60 0.00 View
LPDDR4X 32Gb 7.10 7.10 0.00 View
LPDDR4X 16Gb 3.30 3.30 0.00 View
eMMC Last update:24/09/10 11:00 GMT+8
Item This Week Last Week Change
eMMC 64GB 5.1 4.70 4.70 0.00 View
eMMC 128GB 5.1 8.50 8.70 0.20 View
eMMC 256GB 5.1 17.00 17.20 0.20 View
eMCP Last update:24/09/10 11:00 GMT+8
Item This Week Last Week Change
eMCP(eMMC + LPDDR4X)64GB+32Gb 13.20 13.20 0.00 View
eMCP(eMMC + LPDDR4X)128GB+32Gb 16.40 16.40 0.00 View
eMCP(eMMC + LPDDR4X)128GB+48Gb 21.50 21.50 0.00 View
UFS Last update:24/09/10 11:00 GMT+8
Item This Week Last Week Change
UFS 2.2 64GB 5.20 5.20 0.00 View
UFS 2.2 128GB 9.20 9.50 0.30 View
UFS 2.2 256GB 18.60 18.60 0.00 View
uMCP Last update:24/09/10 11:00 GMT+8
Item This Week Last Week Change
uMCP(LPDDR4X + UFS2.2)4GB+128GB 16.40 16.40 0.00 View
uMCP(LPDDR4X + UFS2.2)6GB+128GB 21.00 21.00 0.00 View
uMCP(LPDDR4X + UFS2.2)8GB+128GB 26.00 26.00 0.00 View
Recommended News
2024/09/11
Samsung Exynos 2500 Specifications Leaked
2024/09/09
Solidigm's Dalian Plant to Increase Equipment Investment
2024/09/09
Intel Reportedly Hands Over Sub-3nm Process to TSMC
2024/09/09
TSMC's Arizona Facility Matches Yield Rates with Taiwan, On Track for Production
2024/09/06
TSMC Announces Advances in 3D IC Technology for AI Chip Integration
2024/09/05
Intel Scraps 20A Node for Arrow Lake, Doubles Down on 18A
2024/09/03
Intel Shifts Focus from Beast Lake to GPUs and AI
2024/09/02
Notice of adding DDR5 Module(Server)product quotations
2024/09/02
TSMC's A16 Process Secures Apple and OpenAI as First Customers
2024/08/30
Intel and IBM Collaborate to Deploy Gaudi 3 AI Accelerators on IBM Cloud
2024/08/30
Intel's Self-Rescue Plan Revealed Amidst 56-Year Crisis
2024/08/26
Apple's iPhone 16 Series Forecasted for 90.1 Million Shipments in H2
2024/08/26
Samsung Aims to Increase Server and AI FCBGA Share to Over 50% by 2026
2024/08/23
Rebellions Aims for 2024 Release of Next-Gen AI Chip REBEL with Samsung's HBM3E
2024/08/22
Qualcomm Launches Snapdragon 7c+ Gen 3 Mobile Platform

Service
@Chinaflashmarket.com