Price Trend
NAND Index
DRAM Index
Stock Information
Update: 07-27 10:34 ,Data has delay
Samsung
KRW
80900
+0.62%
SK Hynix
KRW
191800
+0.95%
Micron
USD
109.410
+1.82%
Intel
USD
31.350
+0.80%
WDC
USD
68.260
+2.66%
Nanya
TWD
58.1
-4.13%
Winbond
TWD
23.45
-1.88%
Phison
TWD
532
-4.83%
SMI
USD
70.080
+2.04%
Marvell
USD
65.720
+2.70%
ASolid
TWD
67.2
-0.88%
Goke
CNY
51.94
+0.37%
Longsys
CNY
80.72
+0.93%
Seagate
USD
103.680
-0.27%
Innodisk
TWD
282.5
-3.25%
Transcend
TWD
95.8
-2.84%
A-DATA
TWD
92.3
-3.25%
SMART Global
USD
23.170
+1.80%
Netac
CNY
17.05
-0.64%
BWCC
CNY
52.46
-1.35%
Techwinsemi
CNY
77.11
+0.47%
DAWEI
CNY
9.23
+1.32%
OSE
TWD
49.4
-4.82%
PTI
TWD
189
+2.72%
JCET
CNY
32.20
+0.34%
ASE
TWD
155.5
-9.86%
TFME
CNY
21.91
+1.39%
HT-tech
CNY
8.26
+0.61%
Hot news
Samsung to mass-produce HBM4 on 4 nm foundry process 24/07/17
The 4 nm node is Samsung’s signature chip foundry manufacturing process with a yield of more than 70%. The company uses the process for the Exynos 2400 chipset, the brain of its flagship AI smartphone Galaxy S24 series.
Flash Wafer
Last update:24/07/26 18:00 GMT+8
DDR
Last update:24/07/23 11:00 GMT+8
DDR Module (Channel)
Last update:24/07/23 11:00 GMT+8
DDR Module (OEM)
Last update:24/07/23 11:00 GMT+8
DDR Module (Server)
Last update:24/07/09 11:00 GMT+8
SSD(Channel)
Last update:24/07/23 11:00 GMT+8
SSD(OEM)
Last update:24/07/23 11:00 GMT+8
LPDDR
Last update:24/07/23 11:00 GMT+8
eMMC
Last update:24/07/23 11:00 GMT+8
eMCP
Last update:24/07/23 11:00 GMT+8
UFS
Last update:24/07/23 11:00 GMT+8
uMCP
Last update:24/07/23 11:00 GMT+8
Flash Card
Last update:24/07/26 18:00 GMT+8
USB 2.0
Last update:24/07/26 18:00 GMT+8
USB 3.0
Last update:24/07/26 13:00 GMT+8
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