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SK hynix’s Confidence: "Our HBM Stronger Than Competitors" 24/06/12
SK hynix claimed that its HBM, manufactured with the company’s unique Mass Reflow-Molded Underfill (MR-MUF) technology, is 60% sturdier than products made using Thermal Compression-Non-Conductive Film (TC-NCF).
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Date
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2024-06-11 0.83 1.23 1.13
2024-06-04 0.85 1.25 1.15
2024-05-28 0.85 1.25 1.15
2024-05-21 0.89 1.29 1.19
2024-05-14 0.9 1.3 1.2
2024-05-07 0.9 1.3 1.2
2024-04-30 0.9 1.3 1.2
2024-04-23 0.89 1.29 1.19
2024-04-16 0.9 1.3 1.2
2024-04-09 0.88 1.28 1.18
2024-04-02 0.86 1.26 1.16
2024-03-26 0.89 1.29 1.19
2024-03-19 0.9 1.3 1.2