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Samsung launches dedicated HBM, advanced chip packaging teams 24/07/05
Samsung Electronics Co., has officially launched a team dedicated to developing advanced high-bandwidth (HBM) memory, a core chip to power artificial intelligence (AI) devices.
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2024-07-09 4.2 5.1 4.9
2024-07-02 4.2 5.1 4.9
2024-06-25 4.2 5.1 4.9
2024-06-18 4.2 5.1 4.9
2024-06-11 4.2 5.1 4.9
2024-06-04 4.2 5.1 4.9
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2024-05-14 4.6 5.6 4.95
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2024-04-23 4.75 5.75 5.1
2024-04-16 4.75 5.75 5.1