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Samsung launches dedicated HBM, advanced chip packaging teams 24/07/05
Samsung Electronics Co., has officially launched a team dedicated to developing advanced high-bandwidth (HBM) memory, a core chip to power artificial intelligence (AI) devices.
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Date
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High
Avg
2024-07-16 2.5 2.85 2.7
2024-07-09 2.5 2.85 2.7
2024-07-02 2.45 2.8 2.65
2024-06-25 2.45 2.8 2.65
2024-06-18 2.45 2.8 2.65
2024-06-11 2.49 2.84 2.69
2024-06-04 2.5 2.85 2.7
2024-05-28 2.5 2.85 2.7
2024-05-21 2.55 2.9 2.75
2024-05-14 2.6 2.95 2.8
2024-05-07 2.65 3 2.85
2024-04-30 2.63 2.98 2.83
2024-04-23 2.64 2.99 2.84
2024-04-16 2.63 2.98 2.83