Hot news
SK hynix Prepares for ‘Fan-out Packaging’ with Next-generation HBM 23/11/27
According to industry sources on Nov. 26, SK hynix is preparing to integrate 2.5D Fan-out packaging technology into its next generation of DRAM after HBM.
Historical Price Information:
Date
Low
Open
Close
2023-11-29 4.4 4.4 4.4
2023-11-28 4.4 4.4 4.4
2023-11-27 4.3 4.3 4.3
2023-11-24 4.3 4.3 4.3
2023-11-23 4.2 4.2 4.2
2023-11-22 4 4 4
2023-11-21 4 4 4
2023-11-20 3.95 3.95 3.95
2023-11-17 3.95 3.95 3.95
2023-11-16 3.95 3.95 3.95
2023-11-15 3.95 3.95 3.95
2023-11-14 3.95 3.95 3.95
2023-11-13 3.9 3.9 3.95
2023-11-10 3.9 3.9 3.9
2023-11-09 3.9 3.9 3.9
2023-11-08 3.9 3.9 3.9
2023-11-07 3.8 3.8 3.8
2023-11-06 3.8 3.8 3.8
2023-11-03 3.8 3.8 3.8
2023-11-02 3.7 3.7 3.7
2023-11-01 3.7 3.7 3.7
2023-10-31 3.7 3.7 3.7
2023-10-30 3.62 3.62 3.62