Stock Information
Last Trade: 328500
Previous Close: 307000
Open： 322000
Change: +7.00%
Trade Time: 2025/09/15
SK Hynix Newsmore»
SK hynix Starts Supplying Mobile DRAM with Highly Efficient Heat Dissipation
SK hynix Begins Mass Production of 321-Layer QLC NAND Flash
SK hynix Presents Future DRAM Technology Roadmap at IEEE VLSI 2025
SK hynix Develops UFS 4.1 Solution Based on 321-High NAND
SK hynix Announces 1Q25 Financial Results
Financial Reportingmore»
SK Hynix 2025Q1 Earning release
SK Hynix 2024Q4 Earning release
SK Hynix 2024Q3 Earning release
SK Hynix 2024Q2 Earning release
SK Hynix 2024Q1 Earning release
SK Hynix Contact
Address of headquarters: 2091, Gyeongchung-daero, Bubal-eup, Icheon-si,Gyeonggi-do, Korea
SK Hynix News
2024-09-05
SK Hynix to Begin Mass Production of 12-layer HBM3E Memory in Late September
2024-09-04
SK Hynix Advances HBM4 Development with Advanced Packaging Technologies
2024-08-29
SK Hynix Unveils World's First 6th Generation 10nm-Class DDR5 DRAM
2024-08-20
SK Hynix to Develop Customized HBM for Major US Tech Firms
2024-08-16
SK Hynix to Introduce High-NA EUV for Advanced Memory in 2026
2024-08-14
SK Hynix Orders Equipment to Increase DRAM Memory Output
2024-08-13
SK Hynix Mulls Over DRAM Technology Shift for Cost Efficiency
2024-08-09
SK Hynix Sees Continued Memory Chip Demand
2024-07-30
SK Hynix Strengthens Graphics Memory Leadership with GDDR7 Introduction
2024-07-29
Solidigm Considers U.S. IPO, Backed by SK hynix
2024-07-26
SK Hynix Forecasts Over 100% Increase in HBM Shipments Next Year
2024-07-26
SK Hynix Announces $67.8 Billion Investment for the First Fab in the Yongin Semiconductor Cluster
2024-07-25
SK Hynix Announces Record-Breaking Q2 2024 Financial Results with Soaring HBM Sales
2024-07-17
SK Hynix's HBM4 Memory to Utilize TSMC's N5 Foundation Die
2024-07-01
SK Hynix to Invest Nearly $60 Billion in HBM and AI-Related Semiconductor Fields by 2028