SK Hynix revealed in its second-quarter earnings briefing on the 25th that the company's High Bandwidth Memory (HBM) sales are projected to experience a threefold increase this year compared to the previous year's figures. Moreover, the company forecasts that HBM shipments for the next year will exceed this year's by more than double.
The South Korean memory chip giant stated that it has concluded discussions with major clients regarding the volume of HBM production for the upcoming year, which has informed its shipment projections. The collaboration between system semiconductor companies like NVIDIA and HBM manufacturers is crucial, as Graphics Processing Units (GPUs) and HBM are often used together in a single package. SK Hynix has completed volume negotiations with its clients, signifying that the company has effectively received orders for the next year and is gearing up for production and shipment accordingly.
Kim Gyu-hyeon, the head of DRAM marketing at SK Hynix, noted, "Considering the relatively low production rate of HBM, there is a limit to the increase in bit numbers even with increased investment. As the generations of HBM evolve, the constraints on production increases will escalate. HBM makes investment decisions based on contract volumes spanning over a year with clients, so an increase in investment also implies an increase in product orders."
In its financial report, SK Hynix indicated that HBM3E will account for over 50% of HBM shipments in the third quarter of this year. In the first half of next year, the company plans to increase the proportion of 12-layer HBM3E over 8-layer HBM3E. Furthermore, SK Hynix is planning to launch a 12-layer HBM4 based on advanced Mass Reflow Underfill (MR-MUF) technology in the second half of next year.
The company's strategic moves reflect its commitment to meeting the growing demand for HBM products, especially in the context of expanding applications in high-performance computing and artificial intelligence sectors. With these advancements, SK Hynix is well-positioned to strengthen its market presence in the HBM segment.
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