SK Hynix's President, Kim Ju Seon, announced at the SEMICON Master Forum that the company's 8-layer HBM3E product, already a market leader, will soon be joined by a 12-layer version, with mass production starting by the end of this month. This advancement comes in response to the significant demand for high-performance memory solutions in AI server applications.

The company holds the highest market share globally for HBM products, and its HBM3E has been the dominant product in the market. The upcoming 12-layer HBM3E is anticipated to further enhance SK Hynix's market position. In addition to the current production, SK Hynix is also collaborating with TSMC on the development of the next-generation HBM4, which will be supplied in line with customer production schedules.

According to previous reports， both the 8-layer and 12-layer HBM3E support a capacity of 36GB, with the ability to handle over 1.18TB of data per second. The forthcoming HBM4 is expected to offer 12-layer and 16-layer products, with maximum capacities of 48GB and data processing speeds exceeding 1.65TB per second.

SK Hynix's continuous innovation in memory technology not only underscores its commitment to staying ahead in the industry but also highlights its readiness to meet the growing demands of advanced computing applications. The company's proactive approach to advancing memory solutions is a testament to its industry leadership and dedication to driving technological progress.