SK Hynix is gearing up to meet the specialized needs of the US technology sector as it has received requests from all seven of the M7—Apple, Microsoft, Alphabet (Google), Tesla, Nvidia, Amazon, and Meta—to develop customized HBM products. Ryu Seong-soo, the Vice President of SK Hynix's HBM business, shared this development at the annual Cheongju Forum, emphasizing the company's commitment to fulfilling the unique requirements of these industry leaders.

Ryu Seong-soo highlighted the company's proactive approach, stating that he has been continuously working over the weekend, engaging in discussions with the M7 enterprises to align the engineering resources of SK Hynix and its supply chain partners across Korea.

The executive anticipates a paradigm shift in the storage industry due to the increasing demand for customized products. SK Hynix is set to capitalize on these changes by not only providing solutions for the mass market but also by introducing differentiated products that offer performance up to 20 to 30 times greater than existing models.

In line with previous reports, SK Hynix is expected to launch a 12-layer stacked HBM4 memory product utilizing MR-MUF bonding technology in the second half of 2025. Furthermore, a 16-layer stacked HBM with higher capacity is anticipated to be released when the demand arises in 2026.

This move by SK Hynix underscores the company's dedication to innovation and its ability to cater to the evolving needs of the tech industry, particularly as the market for AI and high-performance computing continues to expand rapidly.