| 2024-08-12 |
| Samsung P4 to Begin 6th Gen DRAM Production in June |
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| 2024-07-31 |
| Samsung to Begin Mass Production of Advanced HBM3e Chips, Aims for 60% Revenue Contribution |
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| 2024-07-29 |
| Samsung Electronics to Outsource HBM Assembly and Testing Process to Subsidiary STeco |
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| 2024-07-22 |
| Samsung Gears Up for CXL 2.0 DRAM Mass Production by Year-End |
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| 2024-07-16 |
| Samsung Electronics Halts Construction of P4 Phase 2 Foundry Production Line |
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| 2024-07-09 |
| Samsung Electronics to Produce 2nm AI Chips for Japan's Preferred Networks |
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| 2024-07-09 |
| Samsung Electronics Develops Custom HBM for AI Market, Anticipates Commercialization with HBM4 Mass Production |
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| 2024-07-08 |
| Samsung to Introduce FOWLP-HPB-CFM Technology for Improved Thermal Management in Mobile APs |
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| 2024-06-28 |
| Samsung Ramps Up Memory Production to Meet Rising Demand |
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| 2024-06-27 |
| Samsung Seeks $3.6 Billion Loan from Korea Development Bank for Chip Investment |
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| 2024-06-24 |
| Samsung Electronics to Resume Construction of Pyeongtaek P5 Factory in Q3 Amidst AI-driven Demand Surge |
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| 2024-06-20 |
| Samsung Electronics Announces Organizational Restructuring for H2, Emphasizes "Synergy and Streamlining" |
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| 2024-06-17 |
| Samsung to Launch 3D HBM Chip Packaging Service by Year-End |
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| 2024-06-13 |
| Samsung Unveils Integrated One-Stop Service to Accelerate AI Chip Delivery |
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| 2024-06-07 |
| Samsung Electronics Declares Hybrid Bonding Essential for HBM Starting from 16 Stacks |
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