Stock Information
Last Trade: 52900
Previous Close: 52700
Open： 53600
Change: +0.38%
Trade Time: 2025/02/06
Samsung Newsmore»
Samsung Electronics Announces Earnings Guidance for Fourth Quarter 2024
Samsung Electronics Announces New Leadership
Samsung Launches 990 EVO Plus SSD Supported by PCIe 4.0
Samsung Electronics Develops Automotive SSD Based on 8th-Generation V-NAND
Samsung Starts Mass Production of PCle 5.0 PM9E1 SSD
Financial Reportingmore»
Samsung Fiscal Q3 2024 Earnings
Samsung Fiscal Q2 2024 Earnings
Samsung Fiscal Q1 2024 Earnings
Samsung Fiscal Q4 2023 Earnings
Samsung Fiscal Q3 2023 Earnings
Samsung Contact
Tel：4008105858 8008105858
010-64751880
Samsung News
2024-07-31
Samsung to Begin Mass Production of Advanced HBM3e Chips, Aims for 60% Revenue Contribution
2024-07-29
Samsung Electronics to Outsource HBM Assembly and Testing Process to Subsidiary STeco
2024-07-22
Samsung Gears Up for CXL 2.0 DRAM Mass Production by Year-End
2024-07-16
Samsung Electronics Halts Construction of P4 Phase 2 Foundry Production Line
2024-07-09
Samsung Electronics to Produce 2nm AI Chips for Japan's Preferred Networks
2024-07-09
Samsung Electronics Develops Custom HBM for AI Market, Anticipates Commercialization with HBM4 Mass Production
2024-07-08
Samsung to Introduce FOWLP-HPB-CFM Technology for Improved Thermal Management in Mobile APs
2024-06-28
Samsung Ramps Up Memory Production to Meet Rising Demand
2024-06-27
Samsung Seeks $3.6 Billion Loan from Korea Development Bank for Chip Investment
2024-06-24
Samsung Electronics to Resume Construction of Pyeongtaek P5 Factory in Q3 Amidst AI-driven Demand Surge
2024-06-20
Samsung Electronics Announces Organizational Restructuring for H2, Emphasizes "Synergy and Streamlining"
2024-06-17
Samsung to Launch 3D HBM Chip Packaging Service by Year-End
2024-06-13
Samsung Unveils Integrated One-Stop Service to Accelerate AI Chip Delivery
2024-06-07
Samsung Electronics Declares Hybrid Bonding Essential for HBM Starting from 16 Stacks
2024-05-21
Samsung Electronics Names Young Hyun Jun as New Head of Device Solutions Division