In its latest news release, Samsung Electronics has declared that hybrid bonding technology is a must for High Bandwidth Memory (HBM) starting from 16 stacks. This announcement not only showcases Samsung's technological leadership in the field of semiconductor storage but also sets a new standard for the industry.

High Bandwidth Memory (HBM) is renowned for its high data transfer rates and energy efficiency, making it a key technology for high-performance computing and artificial intelligence applications. As technology advances and the number of stacks in HBM increases, the requirements for manufacturing processes become more stringent. Samsung's hybrid bonding technology, which is now deemed essential, enables tighter chip-to-chip connections, thereby enhancing data transfer speeds and storage density.

Samsung's move is expected to have a profound impact on various fields, including high-performance computing, data centers, artificial intelligence, and mobile devices. The promotion of 16-stack HBM technology is anticipated to further enhance the performance and energy efficiency of these domains.

Furthermore, Samsung Electronics has stated that it will continue to invest in research and development to advance HBM technology and explore new application scenarios. Samsung's commitment not only demonstrates its leadership in the semiconductor field but also instills confidence in the industry's innovation and development for the future.