Recommended Hot News
SK hynix Prepares for ‘Fan-out Packaging’ with Next-generation HBM  23/11/27
According to industry sources on Nov. 26, SK hynix is preparing to integrate 2.5D Fan-out packaging technology into its next generation of DRAM after HBM.
SK Hynix to use thick KrF for the production of 238-layer NAND  23/11/20
SK Hynix is expected to apply the new PR when it starts expanding the production of 238-layer 3D NAND to coincide with market recovery.
Chip inventory of Samsung, SK hynix remains high in Q3  23/11/16
Semiconductor inventories of Samsung Electronics Co. and SK hynix Inc. remained at high levels in the third quarter of this year as the prolonged global economic downturn contracted demand, according to financial reports.
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2023-07-05
SK square, SK hynix to Invest 100 Billion Won in Overseas Semiconductor Companies
2023-07-05
Samsung Electronics Shakes Up Its Semiconductor Business Org Chart to Better Recover from Slump
2023-07-04
【CFM Report】Global Memory Industry Monthly Updated Report, June 2023
2023-06-20
2023 Dragon Boat Festival Holiday Notice
2023-06-12
Notice of adding some storage product quotations
2023-04-28
Notice of 2023 International Labour Day Holiday
2023-02-27
Notice of Adjusting the Quotation of SSD(OEM)
2023-01-20
Lunar New Year Holiday Notice
2023-01-13
SK Hynix Wins Intel's Certification on Its 1a DDR5 Server DRAM
2023-01-03
Samsung to build pilot lines at P4 and Taylor fab within year
2022-12-30
Notice of New Year's Day Holiday
2022-12-20
Notice of Adjusting the Quotation of DDR Products
2022-12-13
Notice of Adjusting the DDR Module Product Name
2022-11-11
SK hynix DDR5 & CXL Solutions Validated with AMD EPYC 9004 Series Processors
2022-09-30
Notice of National Day Holiday

 

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