SK Hynix's CEO Kwak Noh-jung recently stated that the company is striving to ship and supply its 12 layer HBM3E as planned, and has given a positive outlook on the demand for artificial intelligence. "Next year, the AI field will also reach a level that is quite worth looking forward to," but at the same time, he said, "The PC and mobile markets are growing, but at a slow pace, with some stagnation. Thanks to the demand for AI, next year will be better.

Regarding the development of next-generation memory, he mentioned innovative technologies such as Compute Express Link (CXL) and stated that products that meet customer needs are being prepared and will be launched at some point next year.

According to the CFM, SK Hynix is developing 96GB and 128GB CXL 2.0 memory solution products based on DDR5, with the goal of achieving commercialization in the second half of this year; Samsung Electronics will mass produce 256GB CMM-D based on CXL 2.0 within this year, and is currently verifying it with major customers; The certified sample of Micron CZ122, a memory expansion module based on CXL 2.0 from Micron, has recently been launched.