Recommended Hot News
SK hynix Prepares for ‘Fan-out Packaging’ with Next-generation HBM　 23/11/27
According to industry sources on Nov. 26, SK hynix is preparing to integrate 2.5D Fan-out packaging technology into its next generation of DRAM after HBM.
SK Hynix to use thick KrF for the production of 238-layer NAND　 23/11/20
SK Hynix is expected to apply the new PR when it starts expanding the production of 238-layer 3D NAND to coincide with market recovery.
Chip inventory of Samsung, SK hynix remains high in Q3　 23/11/16
Semiconductor inventories of Samsung Electronics Co. and SK hynix Inc. remained at high levels in the third quarter of this year as the prolonged global economic downturn contracted demand, according to financial reports.
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2020-12-29
Samsung Display extends South Korea LCD production for unspecified period
2020-12-24
APPLE PLACE ORDERS WITH TSMC FOR 3NM CHIPSETS
2020-12-24
Xiaomi Mi 11 will be the first Snapdragon 888 phone, and it launches very soon
2020-12-21
U.S. blacklisting of SMIC to badly affect production capacity: company
2020-12-21
Samsung Electronics to Launch 5G Smartphones Priced in the 200,000 Won Range
2020-12-21
Microsoft may be developing its own in-house ARM CPU designs
2020-12-18
Huawei to build US$245m manufacturing plant in northeast France
2020-12-18
HUAWEI MATE 40 SELLS OUT INSTANTLY ON MULTIPLE PLATFORMS
2020-12-18
U.S. to Blacklist SMIC and Dozens More China Firms, Reuters Says
2020-12-15
Earthquake in Taiwan Likely to Result in Slower Chip Supply
2020-12-15
Lower TSMC 5nm chip production isn't from low iPhone 12 demand, says Ming-Chi Kuo
2020-12-09
Kioxia Corporation Expands Kitakami Plant Site to Further Increase Flash Memory Production Capacity
2020-12-08
DRAMs Stand First in Semiconductor Sales while NAND Flashes Enjoy Largest Sales Growth
2020-12-07
SK hynix Unveils the Industry's Most Multilayered 176-Layer 4D NAND Flash
2020-12-04
Japan's Kioxia gets US go-ahead to supply server chips to Huawei

 
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