Stock Information
Last Trade: 292000
Previous Close: 284000
Open： 288500
Change: +2.82%
Trade Time: 2025/06/30
SK Hynix Newsmore»
SK hynix Presents Future DRAM Technology Roadmap at IEEE VLSI 2025
SK hynix Develops UFS 4.1 Solution Based on 321-High NAND
SK hynix Announces 1Q25 Financial Results
SK hynix Completes Customer Validation of CXL 2.0-based DDR5
SK hynix delivers world’s first 12-layer HBM4 samples to customers
Financial Reportingmore»
SK Hynix 2025Q1 Earning release
SK Hynix 2024Q4 Earning release
SK Hynix 2024Q3 Earning release
SK Hynix 2024Q2 Earning release
SK Hynix 2024Q1 Earning release
SK Hynix Contact
Address of headquarters: 2091, Gyeongchung-daero, Bubal-eup, Icheon-si,Gyeonggi-do, Korea
SK Hynix News
2025-06-12
SK hynix Presents Future DRAM Technology Roadmap at IEEE VLSI 2025
2025-05-26
SK hynix Develops UFS 4.1 Solution Based on 321-High NAND
2025-04-27
SK hynix Announces 1Q25 Financial Results
2025-04-23
SK hynix Completes Customer Validation of CXL 2.0-based DDR5
2025-03-20
SK hynix delivers world’s first 12-layer HBM4 samples to customers
2024-12-19
SK Hynix develops 61TB SSD for AI data centers
2024-11-22
SK hynix begins production of world's first 321-layer NAND Flash memory chips
2024-09-26
SK hynix Begins Volume Production of 12-Layer HBM3E
2024-09-23
SK hynix Applies CXL Optimization Solution to Linux
2024-09-13
SK hynix Unveils Enhanced AiMX Solution at AI Hardware & Edge AI Summit 2024
2024-09-12
SK Hynix Shifts Focus to Advanced HBM Memory Production, M10F to Become HBM3E Line
2024-09-11
SK hynix Unveils Next-Gen PEB110 SSD for Data Centers
2024-09-05
SK Hynix Emphasizes Customization in HBM Memory with Base Die Technology
2024-09-05
SK Hynix to Begin Mass Production of 12-layer HBM3E Memory in Late September
2024-09-04
SK Hynix Advances HBM4 Development with Advanced Packaging Technologies