SK hynix Inc. has shipped 12-layer HBM4 samples to major customers, accelerating competition in the next-generation artificial intelligence (AI) semiconductor market.

The company announced on Wednesday that it shipped samples of the 12-layer HBM4, a new ultra-high performance DRAM for AI, to major customers and becoming the first in the industry to do so.

“The samples were delivered ahead of schedule based on SK hynix’s technological edge and production experience that have led the HBM market,” the company said in a statement. “SK hynix aims to complete preparations for the mass production of 12-layer HBM4 products within the second half of 2025, strengthening its position in the next-generation AI memory market.”

The HBM4 12-layer features the world’s highest bandwidth and capacity optimized for AI computing. It boasts a data processing speed of over 2 terabytes per second, which is more than 60 percent faster than HBM3E and allows it to process over 400 Full-HD movies in just one second.

A key technology driving SK hynix’s HBM advancement is Advanced MR-MUF, which enables tightly stacked semiconductor chips while minimizing heat generation and warping. By refining this process further, SK hynix has achieved a record capacity of 36GM in a 12-layer configuration.