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Samsung to mass-produce HBM4 on 4 nm foundry process　 24/07/17
The 4 nm node is Samsung’s signature chip foundry manufacturing process with a yield of more than 70%. The company uses the process for the Exynos 2400 chipset, the brain of its flagship AI smartphone Galaxy S24 series.
Samsung launches dedicated HBM, advanced chip packaging teams　 24/07/05
Samsung Electronics Co., has officially launched a team dedicated to developing advanced high-bandwidth (HBM) memory, a core chip to power artificial intelligence (AI) devices.
Samsung applies molybdenum in Gen 9 V-NAND　 24/07/03
Mo is used to improve the resistivity within the transistors, which allows more layers to be stacked in a NAND.
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2020-12-31
Notice of New Year's Day Holiday
2020-12-30
Sony targets 18m PlayStation 5 sales in 2021 following increased TSMC production
2020-12-30
AMD will become TSMC’s largest customer of 7nm next year
2020-12-29
Samsung Display extends South Korea LCD production for unspecified period
2020-12-24
APPLE PLACE ORDERS WITH TSMC FOR 3NM CHIPSETS
2020-12-24
Xiaomi Mi 11 will be the first Snapdragon 888 phone, and it launches very soon
2020-12-21
U.S. blacklisting of SMIC to badly affect production capacity: company
2020-12-21
Samsung Electronics to Launch 5G Smartphones Priced in the 200,000 Won Range
2020-12-21
Microsoft may be developing its own in-house ARM CPU designs
2020-12-18
Huawei to build US$245m manufacturing plant in northeast France
2020-12-18
HUAWEI MATE 40 SELLS OUT INSTANTLY ON MULTIPLE PLATFORMS
2020-12-18
U.S. to Blacklist SMIC and Dozens More China Firms, Reuters Says
2020-12-15
Earthquake in Taiwan Likely to Result in Slower Chip Supply
2020-12-15
Lower TSMC 5nm chip production isn't from low iPhone 12 demand, says Ming-Chi Kuo
2020-12-09
Kioxia Corporation Expands Kitakami Plant Site to Further Increase Flash Memory Production Capacity

 
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