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SK hynix claimed that its HBM, manufactured with the company’s unique Mass Reflow-Molded Underfill (MR-MUF) technology, is 60% sturdier than products made using Thermal Compression-Non-Conductive Film (TC-NCF).
Korea Reviews Policy Support for HBM Chip Manufacturing  24/06/07
The Korean government has initiated a review of policy support, including tax benefits, for materials, parts, and equipment essential for High Bandwidth Memory (HBM) chip manufacturing. This move aims to bolster the country's semiconductor industry, a critical pillar of its economy.
ASML and imec open joint High NA EUV Lithography Lab  24/06/04
Imec and ASML announced the opening of the High NA EUV Lithography Lab in Veldhoven, the Netherlands, a lab jointly run by ASML and imec.
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Update: 06-14 22:47,Data has delay
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SK Hynix KRW 221000 -0.45%
Micron USD 141.040 -1.47%
Intel USD 30.345 -0.38%
WDC USD 77.220 -2.97%
Nanya TWD 66.2 +0.3%
Phison TWD 630 +0.8%
SMI USD 81.740 -0.20%
Marvell USD 72.260 -0.84%
ASolid TWD 77.9 +0.13%
Goke CNY 58.63 -2.91%
Longsys CNY 94.31 +0.33%
Seagate USD 103.535 -1.17%
Innodisk TWD 308 -1.12%
Transcend TWD 121.5 -0.41%
A-DATA TWD 113.5 0%
SMART Global USD 22.260 -1.24%
Netac CNY 24.07 -2.15%
BWCC CNY 55.28 -3.53%
Techwinsemi CNY 88.30 +5.47%
DAWEI CNY 10.44 -1.04%
OSE TWD 60.6 +3.06%
PTI TWD 190.5 +0.53%
JCET CNY 29.05 -0.24%
ASE TWD 166 +1.22%
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