Recommended Hot News
SK hynix considering building new back-end process plant in S. Korea  25/06/24
SK hynix Inc. plans to build a new semiconductor back-end process facility in central South Korea to enhance its chip-packaging capabilities, industry sources said Tuesday.
Samsung Invests Aggressively in Next-Gen DRAM Production as Yields Improve  25/06/20
According to industry sources on July 19, Samsung Electronics achieved a 50-70% yield rate in performance tests of 10nm (nanometer) class 6th-generation DRAM wafers last month. This marks substantial progress compared to the less than 30% yield rate recorded for the same product last year.
Micron Announces DDR4 Sunset Amid Stronger?Than?Ever Demand  25/06/16
In a recent interview, Micron's Executive Vice President and Chief Business Officer, Sumit Sadana, acknowledged that the phase?out comes at a time when demand for DDR4 remains unexpectedly strong. He noted that shortages of both DDR4 and LPDDR4 modules have driven spot-market prices to levels that, in some cases, exceed those of newer DDR5 products.
To view news
2018-03-16
ChipMOS optimistic about COF packaging, demand for NOR and niche-market DRAM
2018-03-16
Hardware-based Protection Coming to Data Center and PC Products Later this Year: Intel CEO
2018-03-15
Broadcom officially ends bid for Qualcomm
2018-03-15
Foxconn top smartphone manufacturer in 4Q17, says IDC
2018-03-15
Top-5 notebook vendors see slight shipment growth in February
2018-03-14
Wistron expects better profits in 2018
2018-03-14
Unigroup will mass-produce 32-layer 3D NAND in 2018 and begin to develop the next-generation 64-layer 3D NAND
2018-03-13
How to tell the good from bad of SSD quality?
2018-03-13
Trump blocks Broadcom-Qualcomm deal, citing national security concerns
2018-03-13
Samsung aims higher sales for Galaxy S9
2018-03-13
Tight supply boosting profits for wafer suppliers
2018-03-12
Apple new entry-level MacBook to reach 4 million in unit shipments in 2018
2018-03-12
Acer looking to expand presence in enterprise notebook market in Middle East, Africa
2018-03-12
Intel Considers Buying Out Broadcom
2018-03-12
Original vendors plus investment in new Fab factory and 3D NAND production competition, the market in 2018 may be over-supply

 

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Update: 07-02 07:40,Data has delay
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SK Hynix KRW 285500 -2.23%
KIOXIA JPY 2363 -5.59%
Micron USD 120.890 -1.91%
WDC USD 63.840 -0.23%
SanDisk USD 44.960 -0.86%
Nanya TWD 49.50 -3.32%
Winbond TWD 19.85 -1.49%
Phison TWD 490.5 -0.10%
SMI USD 74.290 -1.17%
Maxio CNY 41.15 -0.65%
ASolid TWD 54.0 +0.75%
Longsys CNY 85.09 -2.74%
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Transcend TWD 102.5 +1.99%
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PENG USD 20.170 +1.82%
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Techwinsemi CNY 118.69 +0.30%
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