Recommended Hot News
Samsung in Talks with Broadcom to Supply 12-layer HBM3E, Estimated Volume Reaches 1 Billion Gb  25/07/04
According to Korean media reports, Samsung Electronics has recently completed quality testing of its 12-layer HBM3E products with Broadcom and is now negotiating mass production supply. The current discussions involve an estimated supply volume of approximately 1 billion gigabits (Gb), with mass production expected to begin as early as the second half of this year and extend into next year.
Samsung 6th-Gen DRAM Receives Production Readiness Approval  25/07/02
Samsung Electronics achieved a significant technological milestone by securing production readiness approval for its sixth-generation DRAM technology.
SK hynix considering building new back-end process plant in S. Korea  25/06/24
SK hynix Inc. plans to build a new semiconductor back-end process facility in central South Korea to enhance its chip-packaging capabilities, industry sources said Tuesday.
To view news
2024-08-07
NVM Express Unveils Enhanced NVMe 2.1 Specifications for Modern Computing
2024-08-07
Universal Chiplet Interconnect Express (UCIe) Consortium Launches UCIe 2.0 Specification
2024-08-07
Japanese Scientists Innovate EUV Scanners for Cost-Effective Chip Development
2024-08-06
Server Memory Module DDR4 RDIMM Price Adjustment Announcement
2024-08-05
Apple's Q3 Earnings Show Mixed Product Performance
2024-08-02
Intel's Stock Plummets 20% After Announcing Layoffs and Q2 Results
2024-08-01
China's Integrated Circuit Output Reaches 207.1 Billion Units in H1 2024, Up 28.9% YoY
2024-08-01
South Korea's Semiconductor Exports Surge 50.4% YoY in July
2024-08-01
Lam Research Unveils Cryo? 3.0 for 1000-Layer 3D NAND Advancement
2024-07-31
AMD Q2 Earnings Report: Data Center Business Revenue Hits Record High with 115% YoY Increase
2024-07-25
AMD Delays Ryzen 9000 Series Processor Launch Due to Testing Oversight
2024-07-24
Lenovo Aims for AI-Powered PCs by 2027 as Global PC Market Revives
2024-07-23
Hanmi Semiconductor to Expand Production Capacity with New Factory for TC Bonding Machines
2024-07-23
JEDEC Unveils DDR5 MRDIMM and LPDDR6 CAMM Standards to Accelerate High-Performance Computing and AI
2024-07-22
SEMI Calls for Unified Standards in Chip Packaging and Backend Processes

 

Price Trend
Stock Information
Update: 07-08 23:10,Data has delay
Samsung KRW 61400 -0.49%
SK Hynix KRW 282000 +4.06%
KIOXIA JPY 2554 +3.82%
Micron USD 125.232 +4.43%
WDC USD 64.470 -1.14%
SanDisk USD 47.150 +4.27%
Nanya TWD 48.50 -0.82%
Winbond TWD 18.90 -1.05%
Phison TWD 471.5 -0.42%
SMI USD 74.080 +0.38%
Maxio CNY 40.98 +0.71%
ASolid TWD 51.3 -0.39%
Longsys CNY 83.68 +1.43%
Seagate USD 145.360 -2.04%
Innodisk TWD 238.5 -1.65%
Transcend TWD 100.5 -4.29%
A-DATA TWD 93.5 -0.53%
PENG USD 21.620 +3.25%
Netac CNY 24.22 +2.85%
BWCC CNY 65.54 +1.58%
Techwinsemi CNY 121.35 -0.34%
DAWEI CNY 18.67 +0.27%
OSE TWD 37.70 -1.18%
PTI TWD 134.0 +0.75%
JCET CNY 33.55 +1.82%
ASE TWD 143.0 -0.69%
TFME CNY 25.23 +1.24%
HT-tech CNY 9.92 +0.81%