Tokyo Electron Limited (TEL) announced on July 8th the introduction of the Acrevia GCB (Gas Cluster Beam) system, a cutting-edge technology that enables the fine-tuning of EUV lithography patterns to achieve the desired critical dimensions and shapes with high precision. This move positions TEL as a formidable competitor to Applied Materials in the EUV pattern shaping equipment market.

The Acrevia system operates by utilizing a directed gas cluster beam for etching at the optimal wafer tilt angle, allowing for the micro-adjustment of EUV patterns and reducing line edge roughness. This innovative approach minimizes damage to the wafer, thereby reducing defects generated during the lithography process and enhancing overall yield.

In the realm of EUV lithography, achieving finer circuitry structures often involves multiple exposures, a method that can significantly increase lithography costs. However, the pattern shaping equipment introduced by both Tokyo Electron and Applied Materials not only corrects errors but also has the potential to decrease reliance on EUV lithography.

According to reports from Korean media outlet etnews, Applied Materials has already secured orders worth $200 million for its Centura Sculpta system, with TSMC and Intel having adopted the technology. Samsung Electronics is also evaluating the system for its 4nm process applications.

TEL representatives have stated that they are currently assessing the performance of the Acrevia equipment alongside logic and semiconductor contract manufacturing clients. This statement from TEL suggests that the Acrevia system is on the verge of being supplied to the market, indicating a significant step forward in the EUV lithography technology race.