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SK Hynix is reportedly planning to enhance the competitiveness of its 1C DRAM  25/11/06
According to a source in the semiconductor industry cited by South Korean media DDaily, SK Hynix will develop a specific plan for facility adjustments and equipment deployment to introduce the 1c DRAM process after optimizing the production line centered on HBM3E.
Samsung says next year’s HBM capacity already sold out  25/11/06
Samsung also said on Thursday that its HBM capacity for next year has already been sold out and it was receiving additional order requests.
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2014-12-29
Toshiba CEO says will consider overseas locations for chip plant
2014-12-29
Compal plans to hike ODM prices by 5-15% to reflect wage hikes in China
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Samsung Galaxy Note 4 LTE-A With Snapdragon 810 Announced
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Apple's Next 12-inch MacBook Air to Feature USB 3.1 and Core M
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Update: 11-15 14:56,Data has delay
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SK Hynix KRW 560000 -8.50%
KIOXIA JPY 10025 -23.03%
Micron USD 246.830 +4.17%
WDC USD 157.830 +0.43%
SanDisk USD 254.160 +4.35%
Nanya TWD 158.5 -3.06%
Winbond TWD 60.3 -6.07%
Phison TWD 1260 -4.18%
SMI USD 86.740 +0.74%
Maxio CNY 51.09 -6.05%
ASolid TWD 76.9 -5.41%
Longsys CNY 291.07 -10.77%
Seagate USD 258.210 -1.66%
Innodisk TWD 522 -6.45%
Transcend TWD 196.0 -9.26%
A-DATA TWD 213.5 -3.17%
PENG USD 18.900 +0.37%
Netac CNY 31.42 -5.02%
BWCC CNY 127.08 -10.96%
Techwinsemi CNY 270.00 -7.54%
DAWEI CNY 28.22 -6.43%
OSE TWD 49.40 -6.62%
PTI TWD 160.5 -5.59%
JCET CNY 37.05 -3.11%
ASE TWD 222.5 -3.89%
TFME CNY 37.78 -3.87%
HT-tech CNY 11.41 -3.47%