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SK hynix’s Confidence: "Our HBM Stronger Than Competitors"  24/06/12
SK hynix claimed that its HBM, manufactured with the company’s unique Mass Reflow-Molded Underfill (MR-MUF) technology, is 60% sturdier than products made using Thermal Compression-Non-Conductive Film (TC-NCF).
Korea Reviews Policy Support for HBM Chip Manufacturing  24/06/07
The Korean government has initiated a review of policy support, including tax benefits, for materials, parts, and equipment essential for High Bandwidth Memory (HBM) chip manufacturing. This move aims to bolster the country's semiconductor industry, a critical pillar of its economy.
ASML and imec open joint High NA EUV Lithography Lab  24/06/04
Imec and ASML announced the opening of the High NA EUV Lithography Lab in Veldhoven, the Netherlands, a lab jointly run by ASML and imec.
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Samsung bags chip manufacturing orders from Cisco and Google
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French limits on Huawei 5G equipment amount to de facto ban by 2028


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Update: 06-14 22:31,Data has delay
Samsung KRW 79600 +1.27%
SK Hynix KRW 221000 -0.45%
Micron USD 141.150 -1.39%
Intel USD 30.275 -0.61%
WDC USD 77.470 -2.65%
Nanya TWD 66.2 +0.3%
Phison TWD 630 +0.8%
SMI USD 82.750 +1.04%
Marvell USD 72.440 -0.59%
ASolid TWD 77.9 +0.13%
Goke CNY 58.63 -2.91%
Longsys CNY 94.31 +0.33%
Seagate USD 103.700 -1.01%
Innodisk TWD 308 -1.12%
Transcend TWD 121.5 -0.41%
A-DATA TWD 113.5 0%
SMART Global USD 22.268 -1.21%
Netac CNY 24.07 -2.15%
BWCC CNY 55.28 -3.53%
Techwinsemi CNY 88.30 +5.47%
DAWEI CNY 10.44 -1.04%
OSE TWD 60.6 +3.06%
PTI TWD 190.5 +0.53%
JCET CNY 29.05 -0.24%
ASE TWD 166 +1.22%
TFME CNY 23.22 -1.19%
HT-tech CNY 8.26 -0.96%