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Samsung to mass-produce HBM4 on 4 nm foundry process　 24/07/17
The 4 nm node is Samsung’s signature chip foundry manufacturing process with a yield of more than 70%. The company uses the process for the Exynos 2400 chipset, the brain of its flagship AI smartphone Galaxy S24 series.
Samsung launches dedicated HBM, advanced chip packaging teams　 24/07/05
Samsung Electronics Co., has officially launched a team dedicated to developing advanced high-bandwidth (HBM) memory, a core chip to power artificial intelligence (AI) devices.
Samsung applies molybdenum in Gen 9 V-NAND　 24/07/03
Mo is used to improve the resistivity within the transistors, which allows more layers to be stacked in a NAND.
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2020-09-14
Nvidia to buy chip designer Arm for $40 billion as SoftBank exits
2020-09-14
Samsung to make new Qualcomm chips for 5G smartphones with 5nm technology
2020-09-11
LG Display’s Guangzhou Plant to Enter Full-fledged Operation This Month
2020-09-10
South Korean Display Panel Suppliers Cut Business Relations with Huawei
2020-09-09
Korean Chipmakers to Stop Supplying Semiconductors to Huawei Beginning Sept. 15
2020-09-08
Huawei to reportedly produce just 50 million smartphones in 2021
2020-09-07
Huawei reportedly cuts component orders for Mate 40 lineup by 30%, say sources
2020-09-07
ASML, Huawei and Qualcomm may be caught in the crossfire as SMIC runs risk of US blacklist in escalating tech war
2020-09-07
South Korea Still Heavily Dependent on Semiconductor Equipment from Japan
2020-09-04
Korean Government to Ramp up Investment to Commercialize AI Semiconductors
2020-09-04
Apple stock has worst day since mid-March
2020-09-04
ASML “highly unlikely” to obtain EUV export license to China
2020-09-04
July semi sales up 4.9% y-o-y
2020-09-02
Apple reportedly plans to launch 5G iPhones, watches, and an iPad Air in October
2020-09-02
SK-focused Nextin to expand sales from Samsung, YMTC

 
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