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Samsung to mass-produce HBM4 on 4 nm foundry process  24/07/17
The 4 nm node is Samsung’s signature chip foundry manufacturing process with a yield of more than 70%. The company uses the process for the Exynos 2400 chipset, the brain of its flagship AI smartphone Galaxy S24 series.
Samsung launches dedicated HBM, advanced chip packaging teams  24/07/05
Samsung Electronics Co., has officially launched a team dedicated to developing advanced high-bandwidth (HBM) memory, a core chip to power artificial intelligence (AI) devices.
Samsung applies molybdenum in Gen 9 V-NAND  24/07/03
Mo is used to improve the resistivity within the transistors, which allows more layers to be stacked in a NAND.
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2021-03-05
US Senate said to be mulling US$30 billion in funding to boost semiconductor industry
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