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Samsung to mass-produce HBM4 on 4 nm foundry process  24/07/17
The 4 nm node is Samsung’s signature chip foundry manufacturing process with a yield of more than 70%. The company uses the process for the Exynos 2400 chipset, the brain of its flagship AI smartphone Galaxy S24 series.
Samsung launches dedicated HBM, advanced chip packaging teams  24/07/05
Samsung Electronics Co., has officially launched a team dedicated to developing advanced high-bandwidth (HBM) memory, a core chip to power artificial intelligence (AI) devices.
Samsung applies molybdenum in Gen 9 V-NAND  24/07/03
Mo is used to improve the resistivity within the transistors, which allows more layers to be stacked in a NAND.
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Magnachip to be sold to Chinese fund
SK Hynix CEO Vows to Become NAND Flash Market Leader
Samsung Electronics’ Profitability Still Lower than Apple’s in Smartphone Market
Yongin Semiconductor Cluster Construction About to Start
Intel wants to build ARM chips for Apple, third-parties
South Korea and China Increase Patent Applications in Europe
World going through unprecedented chip shortage
Apple reportedly preparing high-end iPads that could launch as soon as April
Huawei plans to start charging patent fees to Samsung, Apple for each phone sold
Samsung chip fallout threatens smartphone and PC supplies
Micron Abandons 3D Xpoint Memory Technology
TSMC sales dropped between January and February, improved on the year
Paik Kwang Industrial and Samsung Electronics Cooperate to Localize Ultra-High Purity Hydrogen Chloride
Revenue per Wafer Climbs As Demand Surges for 5nm/7nm IC Processes
US Senate said to be mulling US$30 billion in funding to boost semiconductor industry


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Update: 07-25 11:55,Data has delay
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