Recommended Hot News
Samsung to mass-produce HBM4 on 4 nm foundry process　 24/07/17
The 4 nm node is Samsung’s signature chip foundry manufacturing process with a yield of more than 70%. The company uses the process for the Exynos 2400 chipset, the brain of its flagship AI smartphone Galaxy S24 series.
Samsung launches dedicated HBM, advanced chip packaging teams　 24/07/05
Samsung Electronics Co., has officially launched a team dedicated to developing advanced high-bandwidth (HBM) memory, a core chip to power artificial intelligence (AI) devices.
Samsung applies molybdenum in Gen 9 V-NAND　 24/07/03
Mo is used to improve the resistivity within the transistors, which allows more layers to be stacked in a NAND.
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2022-12-13
Notice of Adjusting the DDR Module Product Name
2022-11-11
SK hynix DDR5 & CXL Solutions Validated with AMD EPYC 9004 Series Processors
2022-09-30
Notice of National Day Holiday
2022-09-09
Notice of Mid-autumn Festival Holiday
2022-07-25
YMTC launches enterprise-grade PCIe 4.0 NVMe SSD PE310 series
2022-07-25
SK hynix plans to suspend construction of Cheongju plant
2022-06-16
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2022-06-16
SK hynix seeks to improve DRAM production efficiency: cooperates with Lam Research to improve dry lithography technology.
2022-06-08
Canalys: Total spending on cloud services in China reached $7.3 billion in the first quarter
2022-06-08
TSMC: N5 process technology accounts for 19% of overall wafer sales
2022-06-06
Notice of adding some storage product quotations
2022-06-02
2022 Dragon Boat Festival Holiday Notice
2022-05-31
The total number of TSMC's global patent applications exceeds 75,000, and more than 52,000 are approved.
2022-05-31
AMD sued Realtek to the ITC, Realtek states its operation would not be affected
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Huawei unveils next-generation data center innovation

 
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