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South Korea Invests $200 Million in Semiconductor Packaging R&D
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TSMC and Creative Electronics Secure SK Hynix's HBM4 Chip Mega-Order
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Japan's PCB Production Continues to Shrink, but Revenue Decline Marks the Smallest in 18 Months
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SK hynix Achieves 56% Yield in 3D DRAM
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TSMC's 3nm Process Technology Wins Favor from Seven Major Manufacturers
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Intel Chooses TSMC's 3nm Process for Core Ultra 200 Series Processors
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Samsung and SK Hynix Combine 3D DRAM with Advanced Hybrid Bonding Technology
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Advanced Packaging Surge Boosts DISCO's Q1 Profit Forecast by 49%

 

Price Trend
Stock Information
Update: 10-04 05:24,Data has delay
Samsung KRW 89000 +3.49%
SK Hynix KRW 395500 +9.86%
KIOXIA JPY 6180 +14.23%
Micron USD 187.830 +2.28%
WDC USD 131.310 +0.04%
SanDisk USD 128.410 +3.44%
Nanya TWD 83.0 +4.14%
Winbond TWD 38.80 +7.78%
Phison TWD 829 +4.15%
SMI USD 98.850 -3.15%
Maxio CNY 65.80 +7.03%
ASolid TWD 63.8 -0.78%
Longsys CNY 178.03 +20.00%
Seagate USD 252.790 -0.77%
Innodisk TWD 339.5 -0.44%
Transcend TWD 113.5 -1.73%
A-DATA TWD 173.0 +3.28%
PENG USD 27.750 +1.06%
Netac CNY 29.10 +2.90%
BWCC CNY 104.30 +9.34%
Techwinsemi CNY 204.69 +10.00%
DAWEI CNY 19.71 +5.46%
OSE TWD 47.35 +1.28%
PTI TWD 152.0 +0.66%
JCET CNY 44.09 +7.83%
ASE TWD 165.5 +0.61%
TFME CNY 40.17 +5.21%
HT-tech CNY 11.78 +4.16%