On June 24, media reports revealed that TSMC, following its successful contract manufacturing for AI chips of tech giants such as Nvidia and AMD, has partnered with its subsidiary, Creative Electronics, to secure a major order for SK Hynix's critical base interface chips for the next-generation HBM4. This collaboration not only demonstrates TSMC's technical prowess in high-end chip manufacturing but also indicates its further expansion into the HBM4 and advanced packaging technology markets.

Creative Electronics has reportedly received a commissioned design order for SK Hynix's HBM4 chips, with the design expected to be finalized by next year at the earliest. In terms of production, TSMC's 12-nanometer and 5-nanometer process technologies will be utilized depending on the requirements for high performance or low power consumption. Securing this order is anticipated to significantly contribute to Creative Electronics' revenue in the second half of the year and will aid its further integration into the HBM supply chain.

The most significant innovation of HBM4 technology is the increase in the number of DRAM stack layers to 16, along with the integration of a logic IC at the bottom of the HBM to enhance bandwidth transmission speed, which may be one of the reasons why JEDEC relaxed the stacking height restrictions. This crucial logic IC, the base interface chip, is designed by Creative Electronics.

Creative Electronics (GUC) announced its financial results for the first quarter of 2024, which, despite a decline in overall revenue and profit, showed that chips for artificial intelligence and network communication applications contributed a considerable proportion of the revenue, demonstrating the company's competitiveness in these fields.