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2024-12-09
Samsung Completes Development of Groundbreaking 400-layer NAND Technology
2024-12-09
CXL Consortium Announces Compute Express Link 3.2 Specification Release
2024-12-06
SK Hynix beefs up executive team amid high number of promotions
2024-12-03
Korea’s Nov. exports up 1.4% on solid chip demand
2024-11-26
Samsung succeeds in reducing use of PR during 3D NAND lithography
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Nvidia CEO signals Samsung’s imminent shipment of HBM3E
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Tesla asks Samsung, SK Hynix to supply HBM4 chip samples
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Samsung Electronics Expands Packaging Facilities in Suzhou
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Samsung Electronics to expand chip packaging facilities for HBM
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KIOXIA invests $230 million to develop CXL power-saving memory for AI
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Samsung Electronics' Pingze P4 plans to simultaneously mass produce NAND and DRAM
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2024-11-05
SK Hynix to provide HBM3E 16H samples in early 2025
2024-10-31
Samsung Semiconductor's profit decreased by 40% month on month, with plans to normalize inventory levels by the end of the year
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SK Hynix reportedly considers establishing a dedicated HBM business unit

 
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Update: 09-10 15:15,Data has delay
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