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SK Hynix is reportedly planning to enhance the competitiveness of its 1C DRAM  25/11/06
According to a source in the semiconductor industry cited by South Korean media DDaily, SK Hynix will develop a specific plan for facility adjustments and equipment deployment to introduce the 1c DRAM process after optimizing the production line centered on HBM3E.
Samsung says next year’s HBM capacity already sold out  25/11/06
Samsung also said on Thursday that its HBM capacity for next year has already been sold out and it was receiving additional order requests.
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The PM9E1 is Samsung Electronics’ industry-leading PC SSD in terms of performance and capacity, with sequential read and write speeds of up to 14.5 gigabytes (GB) per second.
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2014-04-02
Samsung Announces The New Galaxy Tab 4 Family
2014-04-02
Sony Xperia Z2 Landing In North America This May
2014-04-02
Lenovo Announces New A-Series Range Of Android Tablets
2014-04-02
iPhone 6 Display Panels To Enter Into Production As Early As May
2014-04-02
Tablet application processor shipments in China slip 2.7% in 1Q14
2014-04-02
Asustek braces for strong smartphone competition
2014-04-02
3-mode smartphones to dominate China entry-level market
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ATP Showcases New Industrial Grade mSATA and SlimSATA Solutions
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Intel CEO Outlines New Computing Opportunities with China Technology Ecosystem
2014-04-01
Samsung looks to Google for help in its latest legal battle with Apple
2014-04-01
Intel's SD card-sized computer may not be so tiny after all
2014-04-01
Samsung ATIV SE Specifications Leaked, Coming In April
2014-04-01
Huawei Technologies 2013 revenues up 8.55% on year
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HP ships 7 million notebooks in 1Q14; may return as largest vendor
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TSMC likely to launch 16nm FinFET+ process at year-end 2014

 

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Update: 11-07 11:50,Data has delay
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