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SK Hynix is reportedly planning to enhance the competitiveness of its 1C DRAM  25/11/06
According to a source in the semiconductor industry cited by South Korean media DDaily, SK Hynix will develop a specific plan for facility adjustments and equipment deployment to introduce the 1c DRAM process after optimizing the production line centered on HBM3E.
Samsung says next year’s HBM capacity already sold out  25/11/06
Samsung also said on Thursday that its HBM capacity for next year has already been sold out and it was receiving additional order requests.
Samsung Electronics Supplies SSDs for Nvidia’s DGX Spark Supercomputer  25/10/29
The PM9E1 is Samsung Electronics’ industry-leading PC SSD in terms of performance and capacity, with sequential read and write speeds of up to 14.5 gigabytes (GB) per second.
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2010-01-18
APCB expects 30% growth in 2010 on PCB demand from notebook segment
2010-01-18
PSC to offer cash compensation to encourage conversion of ECB into shares
2010-01-15
Global PC market leaps back to double-digit growth in 4Q09, says IDC
2010-01-15
DDR3 spot price continues growing, says inSpectrum
2010-01-15
Taiwan DRAM makers shifting capacity to DDR3 chips
2010-01-14
IC distributor GMI revenues to grow 25-30% in 2010
2010-01-14
Kingston reportedly pays US$100 million for memory chips to Hynix
2010-01-14
Samsung uses 30-nm NAND flash for mobile memories
2010-01-14
Memory controller maker JMicron eyes 100 million in 2010 shipments
2010-01-13
Taiwan market: Vibo offers own-brand Android smartphones
2010-01-13
Japan chip-gear sales to grow 38% in FY 2010, says SEAJ
2010-01-13
DDR3 contract prices rise in 1H January, DDR2 stays flat
2010-01-13
Hynix intros 2Gb DDR2 for mobile applications
2010-01-12
Rexchip ramping DDR3 output
2010-01-11
NAND flash demand slow in early January

 

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Update: 11-23 03:32,Data has delay
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