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SK Hynix is reportedly planning to enhance the competitiveness of its 1C DRAM  25/11/06
According to a source in the semiconductor industry cited by South Korean media DDaily, SK Hynix will develop a specific plan for facility adjustments and equipment deployment to introduce the 1c DRAM process after optimizing the production line centered on HBM3E.
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2010-12-17
Intel, Micron to ramp delayed fab in 2Q11
2010-12-16
NAND flash contract prices to rise through 1Q11
2010-12-16
Chip equipment spending to slip 1% in 2011, says Gartner
2010-12-15
Zenitron points to touch panel IC and USB 3.0 as main growth drivers in 2011
2010-12-15
DRAM module makers 4Q10 profits likely hurt by rising NT dollar
2010-12-15
Memory packaging house reports November results
2010-12-14
Rexchip lowers capex for 2011
2010-12-13
DDR3 contract prices continue slide in 1H December
2010-12-13
MicroSD card controller orders buoy Skymedi sales in November
2010-12-13
NAND flash spot prices up after Toshiba power outage
2010-12-10
Phison, 3S November revenues down slightly on-month
2010-12-09
Winbond November sales up slightly on-month
2010-12-09
Intel loses 2010 chip market share while Samsung gains, says Gartner
2010-12-09
ProMOS, Rexchip November revenues slide
2010-12-09
Toshiba Says NAND Shipments May Fall on Power Outage

 

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Stock Information
Update: 11-19 17:32,Data has delay
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SK Hynix KRW 562000 -1.40%
KIOXIA JPY 10835 +5.60%
Micron USD 228.500 -5.56%
WDC USD 152.860 -5.90%
SanDisk USD 244.930 -7.88%
Nanya TWD 160.0 -0.31%
Winbond TWD 59.4 -3.26%
Phison TWD 1120 -6.28%
SMI USD 84.540 -1.09%
Maxio CNY 49.10 -1.56%
ASolid TWD 69.2 -2.54%
Longsys CNY 265.56 -2.02%
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