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SK Hynix is reportedly planning to enhance the competitiveness of its 1C DRAM  25/11/06
According to a source in the semiconductor industry cited by South Korean media DDaily, SK Hynix will develop a specific plan for facility adjustments and equipment deployment to introduce the 1c DRAM process after optimizing the production line centered on HBM3E.
Samsung says next year’s HBM capacity already sold out  25/11/06
Samsung also said on Thursday that its HBM capacity for next year has already been sold out and it was receiving additional order requests.
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2011-03-24
Samsung starts mass producing 4Gb mobile DRAM
2011-03-23
Quake impacts memory supply, spot price on the rise
2011-03-23
Silicon wafer and NAND flash supply could determine smartphone and tablet PC...
2011-03-23
DRAM contract prices up 3% in 2H March
2011-03-22
Japan earthquake suspends supply of raw materials used in 25% of global chip...
2011-03-22
Renesas may see USB 3.0 chip shortage after May
2011-03-22
MediaTek has no plans to develop touch controller ICs in-house
2011-03-22
Macronix holds sufficient wafer inventory
2011-03-18
Taiwan firms eyeing USB 3.0 host controller orders
2011-03-18
Memory chip price soars amid supply concerns
2011-03-18
Nanya says no supply fears
2011-03-18
Adata sees no supply disruption concerns
2011-03-17
Powerchip considers using epi wafers if Japan supply squeezes
2011-03-17
Elpida says packaging and testing unit back in operation
2011-03-17
NAND flash contract prices rise in 1H March

 

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Update: 11-22 07:44,Data has delay
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WDC USD 139.190 -0.74%
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