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SK Hynix is reportedly planning to enhance the competitiveness of its 1C DRAM  25/11/06
According to a source in the semiconductor industry cited by South Korean media DDaily, SK Hynix will develop a specific plan for facility adjustments and equipment deployment to introduce the 1c DRAM process after optimizing the production line centered on HBM3E.
Samsung says next year’s HBM capacity already sold out  25/11/06
Samsung also said on Thursday that its HBM capacity for next year has already been sold out and it was receiving additional order requests.
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2011-04-12
Fresco 2-port USB 3.0 host controllers now USB-IF certified
2011-04-12
MediaTek begins marketing EDGE-enabled MT6236 solution
2011-04-11
Memory module firms enjoy rebound in March revenues
2011-04-11
MediaTek 1Q11 revenues down 12% sequentially
2011-04-08
Flash card maker Hagiwara files for bankruptcy protection
2011-04-08
Elpida says packaging and testing unit affected by earthquake
2011-04-08
DRAM contract price rebounds on supply concerns
2011-04-07
7.4 magnitude quake hits Japan, tsunami warning issues for northeast
2011-04-07
Elpida develops 30nm, 4Gb DDR2 mobile RAM
2011-04-07
MediaTek 3Q11 sales to show substantial rebound, says president
2011-04-07
Adata March revenues up 53% on-month
2011-04-07
DRAM makers March revenues up on-month
2011-04-06
IHS iSuppli raises semiconductor forecast for 2011
2011-04-06
Toshiba announces 24nm, ECC-integrated NAND chip
2011-04-06
TI to acquire National Semiconductor for US$6.5 billion

 

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Update: 11-22 07:11,Data has delay
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