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Samsung to mass-produce HBM4 on 4 nm foundry process　 24/07/17
The 4 nm node is Samsung’s signature chip foundry manufacturing process with a yield of more than 70%. The company uses the process for the Exynos 2400 chipset, the brain of its flagship AI smartphone Galaxy S24 series.
Samsung launches dedicated HBM, advanced chip packaging teams　 24/07/05
Samsung Electronics Co., has officially launched a team dedicated to developing advanced high-bandwidth (HBM) memory, a core chip to power artificial intelligence (AI) devices.
Samsung applies molybdenum in Gen 9 V-NAND　 24/07/03
Mo is used to improve the resistivity within the transistors, which allows more layers to be stacked in a NAND.
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2020-07-03
Samsung may not make chips on the 4nm process, jump to 3nm instead
2020-07-03
Japan’s TOK Producing EUV Photoresist in Korea
2020-07-02
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2020-07-02
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2020-06-30
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2020-06-30
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2020-06-29
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2020-06-29
US approved 99% of TSMC’s patents
2020-06-29
Semiconductor Industry: Asia Marketing Review
2020-06-28
Samsung reduces smartphone production target by 40 million units
2020-06-28
White House Wants US Firms to Buy Ericsson, Nokia to Compete With Huawei
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iPhone sales in China drop in May after recent rebound — but Apple shows signs of resilience

 
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