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Samsung in Talks with Broadcom to Supply 12-layer HBM3E, Estimated Volume Reaches 1 Billion Gb  25/07/04
According to Korean media reports, Samsung Electronics has recently completed quality testing of its 12-layer HBM3E products with Broadcom and is now negotiating mass production supply. The current discussions involve an estimated supply volume of approximately 1 billion gigabits (Gb), with mass production expected to begin as early as the second half of this year and extend into next year.
Samsung 6th-Gen DRAM Receives Production Readiness Approval  25/07/02
Samsung Electronics achieved a significant technological milestone by securing production readiness approval for its sixth-generation DRAM technology.
SK hynix considering building new back-end process plant in S. Korea  25/06/24
SK hynix Inc. plans to build a new semiconductor back-end process facility in central South Korea to enhance its chip-packaging capabilities, industry sources said Tuesday.
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2020-11-10
Micron Now Shipping 176-Layer 3D TLC NAND Flash
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Apple Faces Shortages in Power Chips for iPhone 12
2020-11-05
Qualcomm shares surge on optimism over 5G smartphones
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Samsung Display gets U.S. licenses to supply some panels to Huawei: source
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U.S. appeals court rejects immediate WeChat ban
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IBM reports third straight quarter of revenue declines

 

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Update: 07-06 09:40,Data has delay
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SK Hynix KRW 270500 -2.87%
KIOXIA JPY 2380 -6.59%
Micron USD 122.290 +0.45%
WDC USD 66.080 +0.46%
SanDisk USD 46.410 +0.43%
Nanya TWD 48.45 -4.25%
Winbond TWD 19.15 -3.04%
Phison TWD 478.0 -3.24%
SMI USD 74.810 +1.11%
Maxio CNY 41.45 -1.61%
ASolid TWD 52.3 -3.15%
Longsys CNY 83.65 -2.51%
Seagate USD 149.440 -1.65%
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PENG USD 20.870 +3.32%
Netac CNY 23.77 -1.65%
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Techwinsemi CNY 121.38 +2.60%
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