Recommended Hot News
SK hynix’s Confidence: "Our HBM Stronger Than Competitors"  24/06/12
SK hynix claimed that its HBM, manufactured with the company’s unique Mass Reflow-Molded Underfill (MR-MUF) technology, is 60% sturdier than products made using Thermal Compression-Non-Conductive Film (TC-NCF).
Korea Reviews Policy Support for HBM Chip Manufacturing  24/06/07
The Korean government has initiated a review of policy support, including tax benefits, for materials, parts, and equipment essential for High Bandwidth Memory (HBM) chip manufacturing. This move aims to bolster the country's semiconductor industry, a critical pillar of its economy.
ASML and imec open joint High NA EUV Lithography Lab  24/06/04
Imec and ASML announced the opening of the High NA EUV Lithography Lab in Veldhoven, the Netherlands, a lab jointly run by ASML and imec.
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Update: 06-14 23:55,Data has delay
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SK Hynix KRW 221000 -0.45%
Micron USD 140.640 -1.75%
Intel USD 30.435 -0.08%
WDC USD 77.795 -2.24%
Nanya TWD 66.2 +0.3%
Phison TWD 630 +0.8%
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Marvell USD 72.005 -1.19%
ASolid TWD 77.9 +0.13%
Goke CNY 58.63 -2.91%
Longsys CNY 94.31 +0.33%
Seagate USD 103.660 -1.05%
Innodisk TWD 308 -1.12%
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A-DATA TWD 113.5 0%
SMART Global USD 22.360 -0.80%
Netac CNY 24.07 -2.15%
BWCC CNY 55.28 -3.53%
Techwinsemi CNY 88.30 +5.47%
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