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SK Hynix is reportedly planning to enhance the competitiveness of its 1C DRAM  25/11/06
According to a source in the semiconductor industry cited by South Korean media DDaily, SK Hynix will develop a specific plan for facility adjustments and equipment deployment to introduce the 1c DRAM process after optimizing the production line centered on HBM3E.
Samsung says next year’s HBM capacity already sold out  25/11/06
Samsung also said on Thursday that its HBM capacity for next year has already been sold out and it was receiving additional order requests.
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2016-04-07
China market: 2nd-tier smartphone vendors post strong shipment growth in 2015
2016-04-07
ZTE Announces Press Event For April 19, Could Announce Nubia Z11 And Z11 Mini
2016-04-07
Huawei To Launch Flagship Phone In The US
2016-04-07
Meizu Officially Announces m3 note, A 5.5-inch Metal Handset Priced At $120
2016-04-07
HP Introduces New, Very Different Logo
2016-04-07
Huawei Announces P9 And P9 Plus Handsets, Feature Dual Leica Camera And Kirin 955 SoC
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Huawei TalkBand Is The Company's Newest Wearable Device
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Vendors see stable demand for enterprise notebooks thanks to Windows 10
2016-04-06
Global smiconductor market slumps in 2015, IHS says
2016-04-06
Global semiconductor sales dip slightly in February, says SIA
2016-04-06
Samsung Galaxy J7 (2016) With Snapdragon 617 In The Works
2016-04-06
LG Issues A Statement Regarding The Plastic G5 Back Cover
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Update: 11-06 21:08,Data has delay
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